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SN10KHT5563DWR

Texas Instruments

SN10KHT5563DWR by Texas Instruments

SN10KHT5563DWR by Texas Instruments is an 8-function voltage level translator with 24 terminals. It operates b/w 0°C to 75°C, featuring a small outline package style and inverted output polarity. Ideal for TTL to ECL transceiver applications due to its ECL technology and 3-STATE output characteristics.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,447 parts In-Stock

1+ parts

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3,447

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Digiode

USA . 730 parts In-Stock

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730

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,517 parts In-Stock

1+ parts

$3.767

100+ parts

-

1k+ parts

$4.261

10k+ parts

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1,517

$3.767

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$4.261

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DigiPath Technology Company

USA . 1,450 parts In-Stock

1+ parts

$4.148

100+ parts

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1,450

$4.148

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ChromeModa Solutions

Germany . 6,185 parts In-Stock

1+ parts

$4.233

100+ parts

$3.471

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6,185

$4.233

$3.471

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IDEA Electronic Components Group

UK . 431 parts In-Stock

1+ parts

$4.233

100+ parts

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$3.810

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431

$4.233

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$3.810

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AZTECH Wire

Italy . 203 parts In-Stock

1+ parts

$12.519

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203

$12.519

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One Stop Electronics

USA . 1,542 parts In-Stock

1+ parts

$16.500

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1,542

$16.500

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Corphita

USA . 3,714 parts In-Stock

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3,714

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Overview

Enhance your electronic designs with the SN10KHT5563DWR voltage level translator from Texas Instruments. Boasting top-notch quality and precision engineering, this product offers a seamless interface between TTL and ECL transceivers, making it ideal for a wide range of applications. With its compact design and advanced features like 3-STATE output characteristics, this voltage translator provides exceptional value and performance to customers looking to optimize their circuit designs. Trust Texas Instruments for reliable solutions that elevate your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and reliability of the product.

Surface Mount: YES

Surface mount capability allows for easy installation and integration into electronic devices.

No. of Functions: 8

With 8 functions, this voltage level translator offers versatility and flexibility in voltage conversion.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient use of space on circuit boards.

No. of Terminals: 24

Having 24 terminals provides ample connectivity options for various applications.

Package Style (Meter): SMALL OUTLINE

The small outline package style makes this product suitable for compact electronic devices.

Maximum Operating Temperature: 75 °C

With a maximum operating temperature of 75°C, this product can withstand high temperature environments.

Output Characteristics: 3-STATE

The 3-state output allows for three output modes, adding flexibility to the voltage translation process.

Minimum Operating Temperature: 0 °C

Can operate efficiently even at low temperatures, making it suitable for various environments.

Terminal Position: DUAL

Dual terminal position enhances stability and connectivity of the product.

Maximum Seated Height: 2.65 mm

With a low seated height, this product can be used in slim and compact electronic devices.

Width: 7.5 mm

Narrow width allows for efficient use of space on circuit boards.

Output Polarity: INVERTED

Inverted output polarity provides flexibility in voltage translation applications.

Length: 15.4 mm

With a moderate length, this product can fit well in various electronic designs.

Temperature Grade: COMMERCIAL EXTENDED

Commercial extended temperature grade ensures reliable performance in a wide range of operating conditions.

Technology: ECL

ECL technology offers high-speed operation and low power consumption for efficient voltage translation.

Terminal Form: GULL WING

Gull wing terminal form provides secure connections and ease of soldering.

Terminal Pitch: 1.27 mm

The 1.27 mm terminal pitch allows for easy connection to PCBs and other electronic components.

Interface IC Type: TTL TO ECL TRANSCEIVER

The TTL to ECL transceiver interface IC type ensures compatibility with different voltage levels and signal types.

Technical Specifications

Voltage Level Translators SN10KHT5563DWR attributes and parameters. Explore more Voltage Level Translators devices from Texas Instruments

Specs

Interface IC Type:

JESD-30 Code:

R-PDSO-G24

Length:

15.4 mm

No. of Bits:

1

No. of Functions:

8

No. of Terminals:

24

Maximum Operating Temperature:

75 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

3-STATE

Output Latch/Register:

NONE

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

7.5 mm

Trade Compliance

SN10KHT5563DWR Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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