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NB100ELT23LMNR4

Onsemi

NB100ELT23LMNR4 by Onsemi

NB100ELT23LMNR4 by Onsemi is a voltage level translator with 2 functions, operating at 3.3V. It features a max delay of 3.25ns and interfaces as a PECL to TTL translator. Ideal for industrial applications requiring precise signal translation in compact spaces.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 2,145 parts In-Stock

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Vyrian

USA . 2,008 parts In-Stock

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2,008

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Kulean Microsystems

USA . 5,079 parts In-Stock

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5,079

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SupplyDigital Components

Austria . 4,956 parts In-Stock

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4,956

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Corphita

USA . 614 parts In-Stock

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614

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TANS Electronics

Latvia . 446 parts In-Stock

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Corohmni

South Africa . 418 parts In-Stock

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UHIMA Technologies

Türkiye . 194 parts In-Stock

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Problanco Electronics

Mexico . 143 parts In-Stock

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Overview

Enhance your electronic projects with the NB100ELT23LMNR4 by Onsemi, a top-quality voltage level translator that offers seamless signal conversion for a wide range of applications. Manufactured by Onsemi, a trusted name in the industry known for their superior products, this voltage level translator provides reliable performance and precise signal translation. Whether you're working on industrial automation, telecommunications, or consumer electronics, this versatile product ensures smooth operation and efficient communication between different voltage levels. Upgrade your projects with the NB100ELT23LMNR4 and experience the benefits of high-quality signal conversion at an affordable price.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight yet durable, making the voltage level translator easy to handle and resistant to damage.

Surface Mount: YES

Surface mounting allows for easy installation on PCBs, saving time and space in electronic device design.

Maximum Supply Voltage: 3.6 V

Supports a high maximum supply voltage, providing flexibility in various circuit designs.

No. of Functions: 2

Having 2 functions in one device reduces the need for additional components, simplifying circuit design.

Package Shape: SQUARE

The square shape helps with space-saving and efficient placement on the PCB.

Minimum Operating Temperature: -40 °C

A wide temperature range ensures reliable operation in diverse environmental conditions.

Maximum Delay: 3.25 ns

Low delay time ensures fast and efficient signal translation, improving overall circuit performance.

Technical Specifications

Voltage Level Translators NB100ELT23LMNR4 attributes and parameters. Explore more Voltage Level Translators devices from Onsemi

Specs

Maximum Delay:

3.25 ns

Interface IC Type:

JESD-30 Code:

S-PDSO-N8

JESD-609 Code:

e0

Length:

2 mm

No. of Bits:

1

No. of Functions:

2

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Latch/Register:

NONE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC8,.08,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Level Translators

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Width:

2 mm

Trade Compliance

NB100ELT23LMNR4 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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