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5962-87560012A

Onsemi

5962-87560012A by Onsemi

Onsemi's 5962-87560012A is a voltage level translator with 16 terminals in a chip carrier package. It converts TTL to ECL signals, suitable for high-speed communication applications. This surface-mount device is ideal for systems requiring quad-terminal position and no-lead terminal form.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 1,555 parts In-Stock

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Vyrian

USA . 187 parts In-Stock

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Electronic Expediters

USA . 5 parts In-Stock

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Native Components

USA . 186 parts In-Stock

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$0.898

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186

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Northwest PG Solutions

USA . 2,115 parts In-Stock

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$0.988

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$0.988

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Problanco Electronics

Mexico . 8,052 parts In-Stock

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Kulean Microsystems

USA . 4,827 parts In-Stock

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TANS Electronics

Latvia . 3,574 parts In-Stock

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SupplyDigital Components

Austria . 3,104 parts In-Stock

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Corphita

USA . 2,326 parts In-Stock

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Corohmni

South Africa . 259 parts In-Stock

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UHIMA Technologies

Türkiye . 166 parts In-Stock

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Overview

Elevate your voltage level translation game with the 5962-87560012A from Onsemi. As a trusted manufacturer in the industry, Onsemi delivers quality products that exceed expectations. This voltage level translator offers seamless communication between TTL and ECL interfaces, making it ideal for a wide range of applications. With its surface mount capability and compact chip carrier package, this product provides convenience and efficiency in your design projects. Trust Onsemi to provide innovative solutions that meet your needs and elevate your performance.

Feature Benefit Bullets

Surface Mount: YES

Being surface mountable makes it easier to integrate this voltage level translator onto printed circuit boards, saving space and simplifying the manufacturing process.

No. of Terminals: 16

Having 16 terminals allows for versatile connectivity options, enabling this voltage level translator to work with a variety of different devices and circuits.

Package Style: CHIP CARRIER

The chip carrier package style offers good protection for the integrated circuits inside, ensuring durability and reliability in various operating conditions.

Terminal Position: QUAD

The quad terminal position provides stability and ease of connection, making it convenient to integrate this voltage level translator into existing systems.

Terminal Form: NO LEAD

The no-lead terminal form improves signal integrity and reduces potential signal interference, resulting in more accurate voltage level translation.

Interface IC Type: TTL TO ECL TRANSLATOR

The TTL to ECL translator interface IC type allows for seamless communication and compatibility between TTL and ECL devices, making this voltage level translator a versatile and practical choice for various applications.

Technical Specifications

Voltage Level Translators 5962-87560012A attributes and parameters. Explore more Voltage Level Translators devices from Onsemi

Specs

Interface IC Type:

JESD-30 Code:

X-XQCC-N16

No. of Terminals:

16

Package Body Material:

UNSPECIFIED

Package Shape:

Package Style (Meter):

CHIP CARRIER

Qualification:

Not Qualified

Surface Mount:

YES

Terminal Form:

Terminal Position:

QUAD

Trade Compliance

5962-87560012A Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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