Loading...

MC100LVELT22MNR4G

Onsemi

MC100LVELT22MNR4G by Onsemi

MC100LVELT22MNR4G by Onsemi is a Voltage Level Translator with 2 functions, operating at 3.3V. It features a max delay of 0.6ns, suitable for TTL/CMOS to PECL translation in industrial applications. This surface-mount device has a small outline package and operates b/w -40 °C to 85°C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 629 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

629

-

-

-

-

Vyrian

USA . 536 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

536

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

TANS Electronics

Latvia . 8,268 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,268

-

-

-

-

Kulean Microsystems

USA . 4,839 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,839

-

-

-

-

Problanco Electronics

Mexico . 4,300 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,300

-

-

-

-

SupplyDigital Components

Austria . 1,979 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,979

-

-

-

-

Corohmni

South Africa . 330 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

330

-

-

-

-

Corphita

USA . 105 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

105

-

-

-

-

UHIMA Technologies

Türkiye . 23 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

23

-

-

-

-

Overview

Elevate your voltage level translation needs with the MC100LVELT22MNR4G by Onsemi. As a leading manufacturer in the industry, Onsemi delivers exceptional quality and reliability. This voltage level translator is perfect for a wide range of applications, offering seamless and efficient signal conversion. Experience the value and benefits of this product, from its small outline package to its industrial-grade temperature range. Trust Onsemi to provide cutting-edge technology that meets your requirements and exceeds your expectations.

Feature Benefit Bullets

Surface Mount: YES

Allows for easy and convenient mounting on PCBs, saving space and simplifying assembly.

Maximum Supply Voltage: 3.8 V

High maximum supply voltage allows for compatibility with a wide range of systems.

No. of Functions: 2

Provides versatility and the ability to handle multiple functions in a single component.

Package Shape: SQUARE

Square package shape helps in efficient use of PCB space and allows for easy placement in designs.

Power Supplies (V): 3.3

Optimal power supply value for reliable operation and performance.

No. of Terminals: 8

Sufficient number of terminals for connecting to other components and systems.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Compact package style with heat sink and thin profile for efficient heat dissipation and space-saving.

Minimum Supply Voltage: 3 V

Low minimum supply voltage ensures compatibility with various power sources.

Maximum Operating Temperature: 85 °C

Wide operating temperature range suitable for industrial applications.

Minimum Operating Temperature: -40 °C

Can operate in extreme cold conditions, making it versatile for various environments.

Terminal Finish: MATTE TIN

Matte tin finish provides good solderability and prevents oxidation of terminals.

Terminal Position: DUAL

Dual terminal position allows for flexible mounting and connection options.

Maximum Seated Height: 1 mm

Low profile design for minimal space occupation on PCB.

Width: 2 mm

Compact width for efficient PCB layout and space-saving.

Output Polarity: COMPLEMENTARY

Complementary output polarity for reliable signal transmission.

Length: 2 mm

Short length for compact design and space efficiency.

Temperature Grade: INDUSTRIAL

Industrial temperature grade for reliable performance in harsh environments.

Technology: ECL

ECL technology for fast operation and high performance in data communication.

Terminal Form: NO LEAD

No lead terminal form for environmental friendliness and RoHS compliance.

Nominal Supply Voltage: 3.3 V

Stable and reliable voltage supply for consistent performance.

Maximum Delay: 0.6 ns

Low maximum delay ensures fast signal processing and minimal latency.

Terminal Pitch: 0.5 mm

Fine terminal pitch for easy connection and space-saving on PCB.

Interface IC Type: TTL/CMOS TO PECL TRANSLATOR

Translation of different logic levels for seamless communication between systems.

Technical Specifications

Voltage Level Translators MC100LVELT22MNR4G attributes and parameters. Explore more Voltage Level Translators devices from Onsemi

Specs

Maximum Delay:

.6 ns

Interface IC Type:

JESD-30 Code:

S-XDSO-N8

JESD-609 Code:

e3

Length:

2 mm

No. of Bits:

1

No. of Functions:

2

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Latch/Register:

NONE

Output Polarity:

COMPLEMENTARY

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

SOLCC8,.08,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Level Translators

Maximum Supply Voltage:

3.8 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Width:

2 mm

Trade Compliance

MC100LVELT22MNR4G Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20