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5962-8756001EA

Onsemi

5962-8756001EA by Onsemi

Onsemi's 5962-8756001EA is a TTL to ECL translator with 16 terminals in an in-line package. Its ceramic, metal-sealed co-fired body ensures durability. Ideal for voltage level translation applications requiring high reliability and precision.

Median Price

$23.192

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

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Freelance Electronics

USA . 344 parts In-Stock

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Digiode

USA . 2,037 parts In-Stock

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Vyrian

USA . 286 parts In-Stock

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Eagle Technology Solutions

USA . 136 parts In-Stock

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Manoshevitz Elec. Sales

Israel . 76 parts In-Stock

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Resion

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Sunrise Surplus Inc.

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Electronic Expediters

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Electronics Depot

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Speed Components Ltd

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R&J Components

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Inland Empire Components Inc.

USA . 1 parts In-Stock

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Corohmni

South Africa . 58 parts In-Stock

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One Stop Electronics

USA . 1,596 parts In-Stock

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TANS Electronics

Latvia . 5,884 parts In-Stock

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Problanco Electronics

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Northwest PG Solutions

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Kulean Microsystems

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UHIMA Technologies

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SupplyDigital Components

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Overview

Upgrade your voltage level translation needs with the 5962-8756001EA by Onsemi. Crafted with precision and expertise, this voltage level translator offers unparalleled quality and reliability. Ideal for a wide range of applications, this product provides seamless signal conversion from TTL to ECL with ease. Experience the value and benefits of smooth signal transmission and enhanced performance with the 5962-8756001EA by Onsemi. Elevate your projects to the next level with this exceptional voltage level translator.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic material offers high thermal conductivity and excellent electrical insulation, ensuring high performance and reliability.

Package Shape: RECTANGULAR

Rectangular shape allows for easy integration into circuit designs and PCB layouts.

No. of Terminals: 16

Provides versatility in connectivity options and compatibility with various systems.

Package Style (Meter): IN-LINE

In-line package style makes it easy to install and maintain, saving space in the circuit design.

Terminal Position: DUAL

Dual terminal position allows for flexible connection options and supports bidirectional communication.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide strong mechanical connections and ease of soldering for increased durability.

Interface IC Type: TTL TO ECL TRANSLATOR

Specifically designed to translate between TTL and ECL logic levels, enabling seamless communication between devices operating at different voltage levels.

Technical Specifications

Voltage Level Translators 5962-8756001EA attributes and parameters. Explore more Voltage Level Translators devices from Onsemi

Specs

Interface IC Type:

JESD-30 Code:

R-CDIP-T16

No. of Terminals:

16

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Surface Mount:

NO

Terminal Form:

Terminal Position:

DUAL

Trade Compliance

5962-8756001EA Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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