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MC10124FN

Onsemi

MC10124FN by Onsemi

MC10124FN by Onsemi is a voltage level translator with 4 functions, operating at -30 to 85 °C. It has a supply voltage of 5V and -5.2V, with a max delay of 6ns. Ideal for TTL to ECL translation applications due to its ECL10K technology and open-emitter output characteristics.

Median Price

$2.375

Lifecycle Status

Suppliers In-Stock

30

In-Stock Inventory

1k+

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Rochester

USA . 107 parts In-Stock

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$1.950

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$1.740

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$1.640

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DigiKey

USA . 107 parts In-Stock

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Freelance Electronics

USA . 55 parts In-Stock

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$2.031

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Digiode

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American Microsemiconductor Inc.

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Bristol Electronics

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PC Components Company LLC

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Inland Empire Components Inc.

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Connector Distribution Corp

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Right Parts Inc.

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Flex Direct, LLC

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NAC Semi

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ACDS - Activité Composants Distribution Service

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Mentor Electronics Marketing, LLC

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Mil-Aero Solutions, Inc.

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Vectronix, Inc

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CirComp Electronics, Inc.

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Semi Source

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LittleDiode

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Corohmni

South Africa . 233 parts In-Stock

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Corphita

USA . 707 parts In-Stock

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Authorized Procurement Solutions

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Kulean Microsystems

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Problanco Electronics

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Continental Prestige Electronics

USA . 405 parts In-Stock

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Speed Components Ltd (Excess)

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Overview

Enhance your electronic designs with the MC10124FN from Onsemi, a high-quality voltage level translator that offers exceptional performance and reliability. Manufactured by Onsemi, a trusted name in the industry, this product is perfect for a wide range of applications. With its advanced technology and innovative design, the MC10124FN ensures seamless voltage translation, making it a valuable addition to any project. Experience the benefits of this versatile chip carrier package, such as fast operation and precise output characteristics. Trust Onsemi to deliver cutting-edge solutions for all your voltage translation needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The PLASTIC/EPOXY material used in the package body is cost-effective and offers good durability.

Surface Mount: YES

Being surface mountable makes it easier to integrate into different electronic circuit designs.

No. of Functions: 4

Having 4 functions allows for versatile voltage level translation capabilities.

Package Shape: SQUARE

The square package shape provides a compact form factor, ideal for space-constrained designs.

Power Supplies (V): 5,-5.2

Supporting both positive and negative power supplies enables flexibility in voltage requirements.

No. of Terminals: 20

With 20 terminals, there are plenty of connection points for various inputs and outputs.

Package Style (Meter): CHIP CARRIER

The chip carrier package style offers good thermal performance and ease of assembly.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this product can withstand demanding environmental conditions.

Output Characteristics: OPEN-EMITTER

The open-emitter output characteristics provide flexibility in connecting to different devices.

Minimum Operating Temperature: -30 °C

The low minimum operating temperature ensures reliable performance even in cold environments.

Terminal Finish: TIN LEAD

The TIN LEAD terminal finish offers good solderability and electrical conductivity.

Terminal Position: QUAD

The quad terminal position allows for easy and secure connections to external components.

Maximum Seated Height: 4.57 mm

The low maximum seated height helps in keeping the overall profile of the product compact.

Width: 8.965 mm

The moderate width makes it easy to fit into different circuit layouts without taking up too much space.

Output Polarity: COMPLEMENTARY

The complementary output polarity simplifies interfacing with complementary logic devices.

Peak Reflow Temperature °C: 235

The high peak reflow temperature ensures proper soldering and reliability during assembly.

Length: 8.965 mm

The length of the product is proportional to the width, allowing for a balanced design.

Technology: ECL10K

The ECL10K technology offers high-speed performance and low power consumption.

Terminal Form: J BEND

The J BEND terminal form provides mechanical stability and easy insertion during assembly.

Nominal Supply Voltage: 5 V

The 5V nominal supply voltage is a common standard in many electronic systems, ensuring compatibility.

Nominal Negative Supply Voltage: -5.2 V

Supporting a nominal negative supply voltage of -5.2V allows for proper translation of negative logic levels.

Maximum Delay: 6 ns

With a maximum delay of 6 ns, this product offers fast response times for voltage level translation.

Terminal Pitch: 1.27 mm

The 1.27mm terminal pitch enables easy connections on standard PCB layouts.

Interface IC Type: TTL TO ECL TRANSLATOR

The TTL to ECL translator interface IC type allows seamless integration with different logic families.

Technical Specifications

Voltage Level Translators MC10124FN attributes and parameters. Explore more Voltage Level Translators devices from Onsemi

Specs

Maximum Delay:

6 ns

Interface IC Type:

JESD-30 Code:

S-PQCC-J20

JESD-609 Code:

e0

Length:

8.965 mm

Moisture Sensitivity Level (MSL):

1

Nominal Negative Supply Voltage:

-5.2 V

No. of Bits:

1

No. of Functions:

4

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-30 Cel

Output Characteristics:

OPEN-EMITTER

Output Latch/Register:

NONE

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC20,.4SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

235

Power Supplies (V):

5,-5.2

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Sub-Category:

Level Translators

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

ECL10K

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

8.965 mm

Trade Compliance

MC10124FN Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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