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100328FMQB

Texas Instruments

100328FMQB by Texas Instruments

100328FMQB by Texas Instruments is a voltage level translator with 8 functions, operating b/w -55 to 125 °C. It features a max supply voltage of 5.5 V and offers a max delay of 6.5 ns. Ideal for military applications requiring TTL to ECL transceiver interface ICs in compact spaces due to its flatpack package style and ceramic, glass-sealed body material.

Median Price

$32.883

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 10 parts In-Stock

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$5.466

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10

$5.466

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Freelance Electronics

USA . 41 parts In-Stock

1+ parts

$60.300

100+ parts

$63.315

1k+ parts

$59.697

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41

$60.300

$63.315

$59.697

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Vyrian

USA . 7,927 parts In-Stock

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7,927

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Anansix

USA . 2,214 parts In-Stock

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Digiode

USA . 1,174 parts In-Stock

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First Choice Components Inc.

USA . 1 parts In-Stock

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Northwest PG Solutions

USA . 1,765 parts In-Stock

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$2.612

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1,765

$2.612

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Parana Technologies

USA . 622 parts In-Stock

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$5.144

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$5.741

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622

$5.144

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$5.741

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DigiPath Technology Company

USA . 922 parts In-Stock

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$5.664

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$5.664

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ChromeModa Solutions

Germany . 3,413 parts In-Stock

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$5.780

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$4.740

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$5.780

$4.740

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IDEA Electronic Components Group

UK . 1,194 parts In-Stock

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$5.780

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$5.202

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AZTECH Wire

Italy . 685 parts In-Stock

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$7.424

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One Stop Electronics

USA . 460 parts In-Stock

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$47.500

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Corphita

USA . 5,114 parts In-Stock

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Supply Digital

USA . 1,493 parts In-Stock

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Native Components

USA . 476 parts In-Stock

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$2.303

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Perfect Parts

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Overview

Elevate your voltage level translation game with the 100328FMQB by Texas Instruments. This top-notch voltage level translator boasts unmatched quality and precision, making it a reliable choice for a wide range of applications. From seamless surface mount integration to its MIL-STD-883 screening level, this product is designed to exceed expectations. Experience the value and benefits of this versatile device, offering true output polarity, 3-state characteristics, and a maximum delay of just 6.5 ns. Trust in Texas Instruments to deliver excellence in every terminal pitch and package style, setting the standard for performance in the industry.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

The use of ceramic and glass-sealed materials ensures excellent durability and reliability in various environmental conditions.

Maximum Supply Voltage: 5.5 V

The high maximum supply voltage allows for compatibility with a wide range of systems and applications.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this product is suitable for use in demanding industrial and military environments.

Output Characteristics: 3-STATE

The 3-STATE output characteristics allow for versatile signal handling, making it ideal for complex circuitry.

Technology: ECL

The Emitter-Coupled Logic (ECL) technology offers high-speed operation and low power consumption, making it a reliable choice for precision applications.

Technical Specifications

Voltage Level Translators 100328FMQB attributes and parameters. Explore more Voltage Level Translators devices from Texas Instruments

Specs

Maximum Delay:

6.5 ns

Interface IC Type:

JESD-30 Code:

S-GQFP-F24

JESD-609 Code:

e0

Length:

9.398 mm

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

8

No. of Terminals:

24

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Latch/Register:

LATCH

Output Polarity:

TRUE

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

QFF

Package Equivalence Code:

QFL24,.4SQ

Package Shape:

Package Style (Meter):

FLATPACK

Power Supplies (V):

5,-4.5

Qualification:

Not Qualified

Screening Level:

MIL-STD-883

Maximum Seated Height:

2.159 mm

Sub-Category:

Level Translators

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

9.398 mm

Trade Compliance

100328FMQB Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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