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MC10H606FNR2

Onsemi

MC10H606FNR2 by Onsemi

MC10H606FNR2 by Onsemi is a voltage level translator with 6 functions, operating at 4.75-5.25V, suitable for TTL/CMOS to PECL translation. It has a max delay of 3.75ns, operates b/w 0-85 °C, and comes in a square chip carrier package measuring 11.505mm x 11.505mm x 4.57mm.

Median Price

$24.500

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Forefront Electronics and Design

USA . 500 parts In-Stock

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$24.500

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500

$24.500

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Digiode

USA . 2,025 parts In-Stock

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Vyrian

USA . 789 parts In-Stock

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789

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 129 parts In-Stock

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$24.500

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129

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Authorized Procurement Solutions

USA . 8,500 parts In-Stock

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8,500

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TANS Electronics

Latvia . 4,878 parts In-Stock

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Problanco Electronics

Mexico . 4,180 parts In-Stock

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Kulean Microsystems

USA . 2,395 parts In-Stock

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2,395

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Emar International I/E

Canada . 2,000 parts In-Stock

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Corphita

USA . 1,400 parts In-Stock

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SupplyDigital Components

Austria . 1,019 parts In-Stock

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Microchip USA

USA . 383 parts In-Stock

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UHIMA Technologies

Türkiye . 191 parts In-Stock

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Overview

Upgrade your voltage level translation needs with the MC10H606FNR2 by Onsemi. Known for its superior quality and reliability, this product offers seamless integration in a variety of applications. With a maximum supply voltage of 5.25V and a minimum of 4.75V, this chip carrier package is perfect for high-performance systems. Benefit from its fast response time of 3.75ns and complementary output polarity. Trust Onsemi's expertise in technology and innovation to deliver unmatched value and performance. Elevate your projects with the MC10H606FNR2 today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and reliable material for the package body, ensuring long-term performance and protection of internal components.

Surface Mount: YES

Ease of installation and space-saving design for efficient PCB layout.

Maximum Supply Voltage: 5.25 V

Allows for compatibility with a wide range of supply voltage levels in various electronic systems.

No. of Functions: 6

Provides multiple voltage level translation functions in a single device, reducing the need for multiple components.

Package Shape: SQUARE

Compact and standardized package shape for easy integration into existing circuit designs.

Power Supplies (V): 5

Optimal power supply voltage for efficient operation and performance of the device.

No. of Terminals: 28

Sufficient number of terminals for connecting to external components and PCBs.

Package Style (Meter): CHIP CARRIER

Chip carrier package style for improved thermal performance and reliability.

Minimum Supply Voltage: 4.75 V

Allows for operation at lower supply voltages while maintaining stable performance.

Maximum Operating Temperature: 85 °C

Wide operating temperature range for use in diverse environmental conditions.

Output Characteristics: OPEN-EMITTER

Open-emitter output characteristics for versatile signal routing and compatibility.

Minimum Operating Temperature: 0 °C

Suitable for operation in standard room temperatures and cold environments.

Terminal Finish: TIN LEAD

Tin lead terminal finish for improved conductivity and solderability.

Terminal Position: QUAD

Quad terminal position for convenient PCB mounting and connection.

Maximum Seated Height: 4.57 mm

Low seated height for space-constrained applications and compact designs.

Width: 11.505 mm

Optimal width dimension for compatibility with standard PCB layouts.

Output Polarity: COMPLEMENTARY

Complementary output polarity for bidirectional signal translation capabilities.

Peak Reflow Temperature °C: 235

High peak reflow temperature for reliable soldering and assembly processes.

Length: 11.505 mm

Standard length dimension for seamless integration into electronic systems.

Technology: ECL

ECL technology for high-speed and low-power consumption operation.

Terminal Form: J BEND

J bend terminal form for easy PCB mounting and secure connection.

Output Latch/Register: REGISTER

Output latch/register feature for data storage and signal retention.

Nominal Supply Voltage: 5 V

Optimal nominal supply voltage for stable and efficient device performance.

Maximum Delay: 3.75 ns

Low maximum delay for quick voltage level translation and signal processing.

Terminal Pitch: 1.27 mm

Standard terminal pitch for compatibility with common PCB designs and layouts.

Interface IC Type: TTL/CMOS TO PECL TRANSLATOR

Specific interface IC type for seamless translation between TTL/CMOS and PECL signal levels.

Technical Specifications

Voltage Level Translators MC10H606FNR2 attributes and parameters. Explore more Voltage Level Translators devices from Onsemi

Specs

Additional Features:

DIFFERENTIAL PECL INPUT ALSO POSSIBLE

Maximum Delay:

3.75 ns

Interface IC Type:

JESD-30 Code:

S-PQCC-J28

JESD-609 Code:

e0

Length:

11.505 mm

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

6

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

OPEN-EMITTER

Output Latch/Register:

REGISTER

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC28,.5SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

235

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Sub-Category:

Level Translators

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

11.505 mm

Trade Compliance

MC10H606FNR2 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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