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SN100KT5563DWR

Texas Instruments

SN100KT5563DWR by Texas Instruments

SN100KT5563DWR by Texas Instruments is an 8-function voltage level translator with a package style of small outline. Operating temperature ranges from 0 to 85°C, with output polarity inverted and terminal form gull wing. Ideal for TTL to ECL transceiver applications due to its ECL technology and 3-STATE output characteristics.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,826 parts In-Stock

1+ parts

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4,826

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Digiode

USA . 452 parts In-Stock

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452

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,630 parts In-Stock

1+ parts

$11.015

100+ parts

-

1k+ parts

$11.477

10k+ parts

-

1,630

$11.015

-

$11.477

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DigiPath Technology Company

USA . 1,360 parts In-Stock

1+ parts

$12.128

100+ parts

$11.158

1k+ parts

-

10k+ parts

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1,360

$12.128

$11.158

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ChromeModa Solutions

Germany . 5,839 parts In-Stock

1+ parts

$12.376

100+ parts

$10.148

1k+ parts

-

10k+ parts

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5,839

$12.376

$10.148

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IDEA Electronic Components Group

UK . 675 parts In-Stock

1+ parts

$12.376

100+ parts

$11.757

1k+ parts

$11.138

10k+ parts

-

675

$12.376

$11.757

$11.138

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AZTECH Wire

Italy . 684 parts In-Stock

1+ parts

$17.575

100+ parts

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684

$17.575

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One Stop Electronics

USA . 1,440 parts In-Stock

1+ parts

$45.500

100+ parts

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1,440

$45.500

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Corphita

USA . 2,779 parts In-Stock

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2,779

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Overview

Unlock a world of seamless voltage translation with the Texas Instruments SN100KT5563DWR. Designed with precision and expertise, this voltage level translator offers unparalleled quality and reliability. Perfect for a variety of applications, this device provides customers with unmatched value and benefits. Say goodbye to compatibility issues and hello to smooth operation with this state-of-the-art product. Elevate your projects with the SN100KT5563DWR by Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable and long-lasting applications.

Surface Mount: YES

The surface mount feature allows for easy and efficient assembly on circuit boards, saving time and effort during manufacturing.

No. of Functions: 8

With 8 functions, this voltage level translator can handle multiple input signals, providing versatility and flexibility in its applications.

Package Shape: RECTANGULAR

The rectangular shape of the package is space-efficient and allows for easy placement on the circuit board, optimizing the use of available space.

No. of Terminals: 24

Having 24 terminals enables connection to various components and circuits, allowing for complex signal routing and integration.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C ensures reliable performance even in demanding operating conditions.

Output Characteristics: 3-STATE

The 3-state output characteristics provide additional flexibility in controlling the output signals, allowing for more advanced signal processing.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature of 0°C ensures the product can also operate effectively in colder environments.

Terminal Position: DUAL

The dual terminal position allows for versatile mounting options and easy connectivity to the circuit board, enhancing ease of installation.

Maximum Seated Height: 2.65 mm

The compact maximum seated height of 2.65 mm helps save space and allows for a more streamlined design in electronic devices.

Width: 7.5 mm

The narrow width of 7.5 mm enables efficient placement on the circuit board, contributing to a more organized and compact layout.

Output Polarity: INVERTED

The inverted output polarity can be beneficial in certain applications where signal inversion is required, adding to the product's adaptability.

Length: 15.4 mm

The moderate length of 15.4 mm strikes a balance between compactness and functionality, making the product suitable for various electronic devices.

Technology: ECL

Utilizing ECL technology ensures high-speed operation and low power consumption, making the product suitable for applications requiring efficient performance.

Terminal Form: GULL WING

The gull wing terminal form facilitates easy soldering and enhances mechanical strength, contributing to the product's reliability and durability.

Terminal Pitch: 1.27 mm

The small terminal pitch of 1.27 mm allows for compact terminal placement and efficient signal routing, enhancing the product's overall performance.

Interface IC Type: TTL TO ECL TRANSCEIVER

The TTL to ECL transceiver interface IC type ensures seamless integration with different signal standards, expanding the product's compatibility and versatility.

Technical Specifications

Voltage Level Translators SN100KT5563DWR attributes and parameters. Explore more Voltage Level Translators devices from Texas Instruments

Specs

Interface IC Type:

JESD-30 Code:

R-PDSO-G24

Length:

15.4 mm

No. of Bits:

1

No. of Functions:

8

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

3-STATE

Output Latch/Register:

NONE

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

7.5 mm

Trade Compliance

SN100KT5563DWR Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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