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MC10H424L

Onsemi

MC10H424L by Onsemi

MC10H424L by Onsemi is a voltage level translator with 4 functions, operating at 5.25V max supply voltage and -5.2V nominal negative supply voltage. It has a max delay of 2.3ns, making it ideal for TTL to ECL translation in commercial extended temperature applications.

Median Price

$17.520

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

American Microsemiconductor Inc.

USA . 5 parts In-Stock

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$17.520

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Vyrian

USA . 1,599 parts In-Stock

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Digiode

USA . 1,031 parts In-Stock

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1,031

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Zilex Electronics Inc.

Canada . 25 parts In-Stock

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25

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 317 parts In-Stock

1+ parts

$17.520

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317

$17.520

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TANS Electronics

Latvia . 3,740 parts In-Stock

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3,740

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Problanco Electronics

Mexico . 2,799 parts In-Stock

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SupplyDigital Components

Austria . 2,232 parts In-Stock

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UHIMA Technologies

Türkiye . 957 parts In-Stock

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Corphita

USA . 897 parts In-Stock

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Kulean Microsystems

USA . 450 parts In-Stock

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Overview

Experience seamless voltage level translation with the MC10H424L by Onsemi. Designed with precision and reliability in mind, this voltage level translator boasts high-quality ceramic and glass-sealed packaging for optimal performance. With 4 functions packed into its compact rectangular shape, this versatile device is perfect for a wide range of applications. From TTL to ECL translation, this product offers customers unparalleled value, efficiency, and peace of mind. Elevate your projects with the MC10H424L and discover a whole new world of possibilities.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

This material provides durability and protection for the internal components of the voltage level translator.

Maximum Supply Voltage: 5.25 V

Can handle higher voltage levels, allowing for versatility in various applications.

No. of Functions: 4

Multiple functions in one device, saving space and reducing the need for additional components.

Package Shape: RECTANGULAR

Easier to handle and mount on a circuit board compared to irregular shapes.

Power Supplies (V): 5,-5.2

Support for both positive and negative power supplies, making it compatible with different systems.

No. of Terminals: 16

Sufficient terminals for connections, enabling versatile integration into circuits.

Package Style (Meter): IN-LINE

Sleek design for efficient use of space on a circuit board.

Minimum Supply Voltage: 4.75 V

Can function reliably even at lower supply voltages, ensuring stability in various operating conditions.

Maximum Operating Temperature: 75 °C

Can operate effectively in higher temperature environments, increasing its usability in different settings.

Output Characteristics: OPEN-EMITTER

Provides flexibility in connecting to other components or circuits.

Minimum Operating Temperature: 0 °C

Can start up and function in colder temperatures, suitable for a wide range of environments.

Terminal Finish: TIN LEAD

Ensures good conductivity and reliable connections with other components.

Terminal Position: DUAL

Allows for easy and secure connections on both sides of the device.

Maximum Seated Height: 5.08 mm

Low profile for space-saving and compact circuit designs.

Width: 7.62 mm

Compact width for efficient use of space on a circuit board.

Output Polarity: COMPLEMENTARY

Provides balanced signals for improved performance and reliability in data transmission.

Length: 19.49 mm

Balanced length for a compact yet functional design.

Temperature Grade: COMMERCIAL EXTENDED

Suitable for use in commercial applications with extended operating temperature ranges.

Technology: ECL

Uses Emitter-Coupled Logic technology for high-speed and low-power operation.

Terminal Form: THROUGH-HOLE

Easy installation and soldering onto a circuit board.

Nominal Supply Voltage: 5 V

Standard voltage level for compatibility with most systems and components.

Nominal Negative Supply Voltage: -5.2 V

Support for negative supply voltage for balanced power requirements in a circuit.

Maximum Delay: 2.3 ns

Low delay for fast signal transmission and response times in the circuit.

Terminal Pitch: 2.54 mm

Standard terminal pitch for easy connections and compatibility with various connectors.

Interface IC Type: TTL TO ECL TRANSLATOR

Specifically designed to translate signals between TTL and ECL logic levels, making it a versatile interface solution.

Technical Specifications

Voltage Level Translators MC10H424L attributes and parameters. Explore more Voltage Level Translators devices from Onsemi

Specs

Maximum Delay:

2.3 ns

Interface IC Type:

JESD-30 Code:

R-GDIP-T16

JESD-609 Code:

e0

Length:

19.49 mm

Nominal Negative Supply Voltage:

-5.2 V

No. of Bits:

1

No. of Functions:

4

No. of Terminals:

16

Maximum Operating Temperature:

75 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

OPEN-EMITTER

Output Latch/Register:

NONE

Output Polarity:

COMPLEMENTARY

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

5,-5.2

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Sub-Category:

Level Translators

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

ECL

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

MC10H424L Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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