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MC10H604FN

Onsemi

MC10H604FN by Onsemi

MC10H604FN by Onsemi is a voltage level translator with 6 functions, operating at 4.5-5.5V. It features open-emitter output characteristics and offers fast response time of 4ns. Ideal for TTL to ECL translation in applications requiring high-speed signal conversion.

Median Price

$13.826

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 497 parts In-Stock

1+ parts

-

100+ parts

$12.290

1k+ parts

$11.000

10k+ parts

$10.350

497

-

$12.290

$11.000

$10.350

Verical

USA . 497 parts In-Stock

1+ parts

-

100+ parts

$15.363

1k+ parts

$13.750

10k+ parts

$12.938

497

-

$15.363

$13.750

$12.938

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 960 parts In-Stock

1+ parts

$12.030

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960

$12.030

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Digiode

USA . 615 parts In-Stock

1+ parts

$13.006

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615

$13.006

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A2Z Electronics, Inc.

USA . 2,698 parts In-Stock

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2,698

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Prism Electronics

USA . 78 parts In-Stock

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Pegasus Components GmbH

Germany . 50 parts In-Stock

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50

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Bristol Electronics

USA . 48 parts In-Stock

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Rebound Electronics

UK . 40 parts In-Stock

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North Shore Components

USA . 15 parts In-Stock

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Q Components

USA . 6 parts In-Stock

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6

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Distributors (Availability)

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Ampacity Inc.

Singapore . 620 parts In-Stock

1+ parts

$10.230

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620

$10.230

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Corohmni

South Africa . 371 parts In-Stock

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$12.030

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371

$12.030

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Corphita

USA . 1,128 parts In-Stock

1+ parts

$12.321

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1,128

$12.321

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Problanco Electronics

Mexico . 3,591 parts In-Stock

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TANS Electronics

Latvia . 3,005 parts In-Stock

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Kulean Microsystems

USA . 2,523 parts In-Stock

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Perfect Parts

USA . 1,231 parts In-Stock

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Continental Prestige Electronics

USA . 637 parts In-Stock

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SupplyDigital Components

Austria . 496 parts In-Stock

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496

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Microchip USA

USA . 445 parts In-Stock

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445

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Kepictronics

USA . 300 parts In-Stock

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UHIMA Technologies

Türkiye . 42 parts In-Stock

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Assy Fe

Spain . 25 parts In-Stock

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Overview

Enhance your electronic designs with the MC10H604FN voltage level translator from Onsemi. With a reputation for quality and reliability, Onsemi delivers cutting-edge technology in a compact chip carrier package. Ideal for TTL to ECL translation, this versatile device offers fast response times and low power consumption, making it perfect for a wide range of applications. Trust Onsemi to provide innovative solutions that bring value and efficiency to your projects. Upgrade your designs today with the MC10H604FN and experience the benefits firsthand.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and provides good protection for the internal components, making the product reliable and long-lasting.

Maximum Supply Voltage: 5.5 V

With a high maximum supply voltage, this product can handle a wide range of input voltages, providing flexibility in different applications.

Package Shape: SQUARE

The square package shape provides efficient use of space on a circuit board, allowing for a compact design.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures that the product can withstand elevated temperatures without compromising performance.

Output Characteristics: OPEN-EMITTER

Open-emitter output characteristics offer flexibility in connecting to different types of circuits, enhancing compatibility with various systems.

Technology: ECL

ECL technology provides high-speed performance and low power consumption, making the product suitable for demanding applications that require fast signal processing.

Technical Specifications

Voltage Level Translators MC10H604FN attributes and parameters. Explore more Voltage Level Translators devices from Onsemi

Specs

Maximum Delay:

4 ns

Interface IC Type:

JESD-30 Code:

S-PQCC-J28

JESD-609 Code:

e0

Length:

11.505 mm

Nominal Negative Supply Voltage:

-5.2 V

No. of Bits:

1

No. of Functions:

6

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

OPEN-EMITTER

Output Latch/Register:

REGISTER

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC28,.5SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

235

Power Supplies (V):

5,-5.2

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Sub-Category:

Level Translators

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn80Pb20)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

11.505 mm

Trade Compliance

MC10H604FN Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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