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MC100H606FNR2

Onsemi

MC100H606FNR2 by Onsemi

MC100H606FNR2 by Onsemi is a voltage level translator with 6 functions, operating at 5V. It features ECL technology, open-emitter output characteristics, and a max delay of 3.75ns. Ideal for translating TTL/CMOS to PECL signals in various electronic applications.

Median Price

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Lifecycle Status

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2

In-Stock Inventory

1k+

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Digiode

USA . 2,147 parts In-Stock

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Vyrian

USA . 232 parts In-Stock

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Problanco Electronics

Mexico . 8,376 parts In-Stock

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SupplyDigital Components

Austria . 3,994 parts In-Stock

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Kulean Microsystems

USA . 3,637 parts In-Stock

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TANS Electronics

Latvia . 2,488 parts In-Stock

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Corphita

USA . 1,675 parts In-Stock

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Corohmni

South Africa . 476 parts In-Stock

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UHIMA Technologies

Türkiye . 464 parts In-Stock

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Overview

Unlock the potential of your electronic designs with the MC100H606FNR2 by Onsemi, a leading manufacturer in voltage level translators. This versatile product offers seamless translation between TTL/CMOS to PECL interfaces, providing reliable signal conversion for a wide range of applications. With six functions packed into a compact chip carrier package, this voltage translator delivers high performance and precision while ensuring compatibility with various power supplies. Trust Onsemi for quality, efficiency, and innovation in your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy makes the package durable and lightweight, suitable for various applications.

Surface Mount: YES

Being surface mountable allows for easy and efficient PCB assembly, saving space and reducing production costs.

Maximum Supply Voltage: 5.25 V

Can safely operate at a maximum supply voltage of 5.25V, providing a wide range of compatibility with different systems.

No. of Functions: 6

Having 6 functions in one device offers versatility and flexibility in voltage level translation applications.

Package Shape: SQUARE

The square package shape allows for efficient use of board space and easy integration into a circuit layout.

Power Supplies (V): 5

Operates on a standard power supply voltage of 5V, making it compatible with many existing systems.

No. of Terminals: 28

With 28 terminals, there are plenty of connection options for interfacing with other components or systems.

Package Style (Meter): CHIP CARRIER

The chip carrier package style offers a compact form factor and good thermal performance for reliable operation.

Minimum Supply Voltage: 4.75 V

With a minimum supply voltage requirement of 4.75V, it can still function reliably even with slightly lower voltage inputs.

Maximum Operating Temperature: 85 °C

Capable of operating at high temperatures up to 85 °C, suitable for a wide range of environments and applications.

Output Characteristics: OPEN-EMITTER

Open-emitter output characteristics provide flexibility in interfacing with different types of logic circuits.

Minimum Operating Temperature: 0 °C

Can operate at temperatures as low as 0 °C, making it suitable for industrial or outdoor applications in cold environments.

Terminal Finish: TIN LEAD

Tin-lead terminal finish offers good solderability and reliability in electrical connections.

Terminal Position: QUAD

The quad terminal position allows for easy and secure mounting on the PCB, ensuring stable electrical connections.

Maximum Seated Height: 4.57 mm

With a low maximum seated height of 4.57mm, it can be used in compact space-constrained designs.

Width: 11.505 mm

The moderate width of 11.505mm provides a balance between space savings and ease of handling during assembly.

Output Polarity: COMPLEMENTARY

Complementary output polarity simplifies interfacing with different types of logic circuits and devices.

Length: 11.505 mm

The length of 11.505mm complements the width, creating a compact and space-efficient package.

Technology: ECL

Utilizing ECL technology offers high-speed performance and low power consumption, ideal for demanding applications.

Terminal Form: J BEND

The J bend terminal form allows for easy and secure soldering to the PCB, ensuring reliable electrical connections.

Output Latch/Register: REGISTER

Having a register output latch provides signal stability and improved noise immunity in high-frequency applications.

Nominal Supply Voltage: 5 V

Operating at a nominal supply voltage of 5V ensures compatibility with standard power sources and existing systems.

Maximum Delay: 3.75 ns

With a maximum delay of 3.75ns, it offers fast response times for quick signal processing and high-speed applications.

Terminal Pitch: 1.27 mm

The 1.27mm terminal pitch allows for precise and spaced out connections, reducing the risk of short circuits or signal interference.

Interface IC Type: TTL/CMOS TO PECL TRANSLATOR

Specifically designed as a translator from TTL/CMOS to PECL, providing seamless integration between different logic voltage levels.

Technical Specifications

Voltage Level Translators MC100H606FNR2 attributes and parameters. Explore more Voltage Level Translators devices from Onsemi

Specs

Additional Features:

DIFFERENTIAL PECL INPUT ALSO POSSIBLE

Maximum Delay:

3.75 ns

Interface IC Type:

JESD-30 Code:

S-PQCC-J28

JESD-609 Code:

e0

Length:

11.505 mm

No. of Bits:

1

No. of Functions:

6

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

OPEN-EMITTER

Output Latch/Register:

REGISTER

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC28,.5SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Sub-Category:

Level Translators

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

11.505 mm

Trade Compliance

MC100H606FNR2 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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