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MC100EPT22DTR2G

Onsemi

MC100EPT22DTR2G by Onsemi

MC100EPT22DTR2G by Onsemi is a voltage level translator with 2 functions, operating at 3.3V. It has a max delay of 0.7ns and interface IC type as TTL/CMOS to PECL translator. Ideal for industrial applications requiring precise signal translation in compact spaces.

Median Price

$7.763

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 2,900 parts In-Stock

1+ parts

$11.150

100+ parts

$7.607

1k+ parts

-

10k+ parts

$6.630

2,900

$11.150

$7.607

-

$6.630

Rochester

USA . 2,890 parts In-Stock

1+ parts

-

100+ parts

$6.210

1k+ parts

$5.560

10k+ parts

$5.230

2,890

-

$6.210

$5.560

$5.230

Verical

USA . 1,301 parts In-Stock

1+ parts

-

100+ parts

$7.763

1k+ parts

$6.950

10k+ parts

$6.537

1,301

-

$7.763

$6.950

$6.537

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 84 parts In-Stock

1+ parts

$6.564

100+ parts

-

1k+ parts

-

10k+ parts

-

84

$6.564

-

-

-

Vyrian

USA . 324 parts In-Stock

1+ parts

$6.910

100+ parts

-

1k+ parts

-

10k+ parts

-

324

$6.910

-

-

-

Flip Electronics

USA . 10,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

10,000

-

-

-

-

Semi Source

USA . 2,020 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,020

-

-

-

-

ComSIT Distribution GmbH

Germany . 36 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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36

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 4,450 parts In-Stock

1+ parts

$5.870

100+ parts

-

1k+ parts

-

10k+ parts

-

4,450

$5.870

-

-

-

Corphita

USA . 141 parts In-Stock

1+ parts

$6.219

100+ parts

-

1k+ parts

-

10k+ parts

-

141

$6.219

-

-

-

Corohmni

South Africa . 115 parts In-Stock

1+ parts

$6.910

100+ parts

-

1k+ parts

-

10k+ parts

-

115

$6.910

-

-

-

Microchip USA

USA . 3,636 parts In-Stock

1+ parts

$19.180

100+ parts

$18.910

1k+ parts

$18.770

10k+ parts

$18.640

3,636

$19.180

$18.910

$18.770

$18.640

Kulean Microsystems

USA . 7,352 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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7,352

-

-

-

-

TANS Electronics

Latvia . 6,691 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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6,691

-

-

-

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SupplyDigital Components

Austria . 5,976 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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5,976

-

-

-

-

Problanco Electronics

Mexico . 3,622 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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3,622

-

-

-

-

Authorized Procurement Solutions

USA . 2,500 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

-

10k+ parts

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2,500

-

-

-

-

Kepictronics

USA . 1,900 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,900

-

-

-

-

Assy Fe

Spain . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,000

-

-

-

-

UHIMA Technologies

Türkiye . 351 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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351

-

-

-

-

Overview

Unlock new possibilities with the MC100EPT22DTR2G voltage level translator by Onsemi. This cutting-edge device offers seamless integration and impeccable performance, thanks to Onsemi's reputation for top-quality manufacturing. Ideal for a wide range of applications, this product ensures reliable signal translation with precision and efficiency. Elevate your projects with the MC100EPT22DTR2G and experience unparalleled value and benefits that will exceed your expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable or rugged applications.

Surface Mount: YES

Being surface mountable allows for easy and efficient PCB assembly, saving time and reducing manual labor.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage ensures compatibility with a wide range of electronic devices and systems.

No. of Functions: 2

Having multiple functions in one device increases functionality and versatility, saving space on the PCB.

Package Shape: SQUARE

The square package shape allows for efficient use of board space, especially in compact designs.

Power Supplies (V): 3.3

The 3.3V power supply ensures compatibility with standard voltage levels in many digital systems.

No. of Terminals: 8

Having 8 terminals provides sufficient connectivity options, allowing for versatile integration in circuits.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline, thin profile, and shrink pitch package style saves PCB space and allows for high-density mounting.

Minimum Supply Voltage: 3 V

The low minimum supply voltage ensures compatibility with a wide range of power sources, making it suitable for various applications.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature makes the device suitable for industrial applications where temperature fluctuations may occur.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures reliable operation even in cold environments, increasing the product's versatility.

Terminal Finish: MATTE TIN

The matte tin terminal finish provides good solderability and corrosion resistance, ensuring a reliable connection over time.

Terminal Position: DUAL

The dual terminal position allows for flexibility in PCB layout and simplifies the connection of multiple devices.

Maximum Seated Height: 1.1 mm

The low seated height helps reduce the overall height of the device and allows for compact designs.

Width: 3 mm

The compact width of 3mm enables high-density mounting on the PCB, saving space for other components.

Output Polarity: COMPLEMENTARY

Having complementary output polarity simplifies circuit design and ensures proper signal transmission between devices.

Maximum Time At Peak Reflow Temperature (s): 30

The 30-second maximum time at peak reflow temperature ensures proper soldering and prevents overheating during assembly.

Peak Reflow Temperature °C: 260

With a peak reflow temperature of 260°C, the device can withstand high-temperature soldering processes without damage.

Length: 3 mm

The compact length of 3mm allows for efficient use of board space, especially in tight layouts.

Temperature Grade: INDUSTRIAL

Being industrial-grade means the device is designed to withstand harsh environmental conditions, making it suitable for industrial applications.

Technology: ECL

Using ECL technology ensures high-speed operation and low power consumption, making the product efficient and reliable.

Terminal Form: GULL WING

The gull wing terminal form provides mechanical strength and easy soldering, ensuring a secure connection on the PCB.

Nominal Supply Voltage: 3.3 V

The 3.3V nominal supply voltage ensures stable and consistent power delivery to the device, enhancing performance and reliability.

Maximum Delay: 0.7 ns

The extremely low maximum delay of 0.7ns ensures fast signal transmission, making the device suitable for high-speed applications.

Terminal Pitch: 0.65 mm

The tight terminal pitch of 0.65mm allows for high-density mounting on the PCB, saving space and enabling compact designs.

Moisture Sensitivity Level (MSL): 3

With an MSL of 3, the device can withstand multiple reflows without damage, making it suitable for reworkable applications.

Interface IC Type: TTL/CMOS TO PECL TRANSLATOR

The interface IC type of TTL/CMOS to PECL translator ensures seamless communication between different logic voltage levels, allowing for interoperability in mixed-signal systems.

Technical Specifications

Voltage Level Translators MC100EPT22DTR2G attributes and parameters. Explore more Voltage Level Translators devices from Onsemi

Specs

Maximum Delay:

.7 ns

Interface IC Type:

JESD-30 Code:

S-PDSO-G8

JESD-609 Code:

e3

Length:

3 mm

Moisture Sensitivity Level (MSL):

3

No. of Bits:

1

No. of Functions:

2

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Latch/Register:

NONE

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.19

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Level Translators

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3 mm

Trade Compliance

MC100EPT22DTR2G Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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