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MC10H125ML1

Onsemi

MC10H125ML1 by Onsemi

MC10H125ML1 by Onsemi is a voltage level translator with 4 functions, operating at 0-75 °C. It has a supply voltage range of 4.75-5.25 V and offers ECL technology for ECL to TTL translation applications. The package is small outline, surface mountable with 16 terminals in a rectangular shape.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 2,482 parts In-Stock

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Digiode

USA . 879 parts In-Stock

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Kulean Microsystems

USA . 7,571 parts In-Stock

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TANS Electronics

Latvia . 3,781 parts In-Stock

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Problanco Electronics

Mexico . 2,642 parts In-Stock

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Corphita

USA . 1,484 parts In-Stock

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Metaverse IC Inc.

Canada . 1,409 parts In-Stock

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Assy Fe

Spain . 1,000 parts In-Stock

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SupplyDigital Components

Austria . 276 parts In-Stock

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Perfect Parts

USA . 232 parts In-Stock

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UHIMA Technologies

Türkiye . 135 parts In-Stock

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Corohmni

South Africa . 92 parts In-Stock

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Overview

Elevate your voltage level translation with the MC10H125ML1 by Onsemi. This high-quality product offers unmatched precision and reliability, thanks to Onsemi's dedication to excellence in manufacturing. Perfect for a wide range of applications, this voltage level translator brings value and efficiency to your projects. Say goodbye to compatibility issues and hello to seamless connectivity with the MC10H125ML1. Trust Onsemi to deliver cutting-edge technology that makes a difference.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring a longer lifespan for the product.

Surface Mount: YES

Easy to install and saves space on the circuit board, making it a convenient choice for compact electronic devices.

Maximum Supply Voltage: 5.25 V

Can handle a higher supply voltage, offering stability and reliability in various operating conditions.

No. of Functions: 4

Allows for multiple voltage level translations in a single device, reducing the need for multiple components and simplifying the circuit design.

Package Shape: RECTANGULAR

Facilitates easy integration into standard PCB layouts, ensuring compatibility with existing designs.

No. of Terminals: 16

Provides ample connection points for interfacing with other electronic components, supporting versatile applications.

Minimum Operating Temperature: 0 °C

Can operate effectively in low-temperature environments, making it suitable for a wide range of operating conditions.

Output Polarity: TRUE

Ensures consistent and accurate voltage level translations, minimizing errors in data transmission.

Maximum Delay: 3.4 ns

Offers fast signal processing speed, reducing latency in voltage level translations for efficient performance.

Interface IC Type: ECL TO TTL TRANSLATOR

Specifically designed for translating signals between ECL and TTL logic levels, making it an ideal choice for interfacing different types of circuits.

Technical Specifications

Voltage Level Translators MC10H125ML1 attributes and parameters. Explore more Voltage Level Translators devices from Onsemi

Specs

Maximum Delay:

3.4 ns

Interface IC Type:

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Nominal Negative Supply Voltage:

-5.2 V

No. of Bits:

1

No. of Functions:

4

No. of Terminals:

16

Maximum Operating Temperature:

75 Cel

Minimum Operating Temperature:

0 Cel

Output Latch/Register:

NONE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Position:

DUAL

Trade Compliance

MC10H125ML1 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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