Loading...

MC10H607FN

Onsemi

MC10H607FN by Onsemi

MC10H607FN by Onsemi is a voltage level translator with 6 functions, operating b/w 4.75V to 5.25V. It features PECL to TTL translation, true output polarity, and an 8.3ns max delay. Ideal for applications requiring precise signal conversion in compact spaces due to its small chip carrier package style.

Median Price

$1.850

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 9,938 parts In-Stock

1+ parts

-

100+ parts

$1.750

1k+ parts

$1.560

10k+ parts

$1.470

9,938

-

$1.750

$1.560

$1.470

Verical

USA . 9,938 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.950

10k+ parts

$1.837

9,938

-

-

$1.950

$1.837

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 654 parts In-Stock

1+ parts

$1.852

100+ parts

-

1k+ parts

-

10k+ parts

-

654

$1.852

-

-

-

Vyrian

USA . 906 parts In-Stock

1+ parts

$1.950

100+ parts

-

1k+ parts

-

10k+ parts

-

906

$1.950

-

-

-

Connector Distribution Corp

USA . 640 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

640

-

-

-

-

Right Parts Inc.

USA . 640 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

640

-

-

-

-

Cyclops Electronics Ltd

UK . 52 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

52

-

-

-

-

A2Z Electronics, Inc.

USA . 51 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

51

-

-

-

-

Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

USA . 36 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

36

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,271 parts In-Stock

1+ parts

$1.755

100+ parts

-

1k+ parts

-

10k+ parts

-

2,271

$1.755

-

-

-

Corohmni

South Africa . 196 parts In-Stock

1+ parts

$1.950

100+ parts

-

1k+ parts

-

10k+ parts

-

196

$1.950

-

-

-

Continental Prestige Electronics

USA . 9,938 parts In-Stock

1+ parts

-

100+ parts

$1.720

1k+ parts

-

10k+ parts

-

9,938

-

$1.720

-

-

TANS Electronics

Latvia . 7,459 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,459

-

-

-

-

Kulean Microsystems

USA . 5,393 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,393

-

-

-

-

Problanco Electronics

Mexico . 4,468 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,468

-

-

-

-

SupplyDigital Components

Austria . 1,332 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,332

-

-

-

-

Kepictronics

USA . 555 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

555

-

-

-

-

Microchip USA

USA . 395 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

395

-

-

-

-

UHIMA Technologies

Türkiye . 52 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

52

-

-

-

-

Overview

Unlock seamless voltage level translation with the MC10H607FN by Onsemi. Crafted with precision and reliability in mind, this voltage level translator is designed to elevate your electronic projects to new heights. From PECL to TTL translation, this chip carrier package offers 6 functions with a true output polarity, ensuring optimal performance. Embrace the future of technology with the MC10H607FN and experience the ease of voltage level translation like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, suitable for various applications.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on PCBs, saving space and reducing assembly time.

Maximum Supply Voltage: 5.25 V

The high maximum supply voltage tolerance ensures reliable operation and protects the device from potential damage due to voltage spikes.

No. of Functions: 6

Having multiple functions in a single device increases functionality and flexibility, making it versatile for different system requirements.

Package Shape: SQUARE

The square package shape provides a compact form factor, making it easier to integrate into tight spaces on the PCB.

Power Supplies (V): 5

Operating at a standard power supply voltage of 5V makes it compatible with a wide range of systems and components.

No. of Terminals: 28

Having a higher number of terminals allows for more connections and interfaces, enabling seamless integration with other components.

Package Style (Meter): CHIP CARRIER

The chip carrier package style provides excellent thermal and electrical performance, ensuring reliable operation in a compact size.

Minimum Supply Voltage: 4.75 V

The low minimum supply voltage threshold ensures compatibility with systems operating at lower voltage levels, increasing its usability.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature range allows the product to function effectively in harsh environments and under heavy load conditions.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature ensures reliable performance even in cold or refrigerated environments.

Terminal Finish: TIN LEAD

The use of tin lead terminal finish provides good solderability and conductivity, ensuring secure connections and long-term reliability.

Terminal Position: QUAD

The quad terminal position allows for easy access and connectivity, simplifying the integration process and reducing installation time.

Maximum Seated Height: 4.57 mm

The low maximum seated height makes the product suitable for applications with space constraints, allowing for a more compact design.

Width: 11.505 mm

The compact width size makes it easy to fit the product on a PCB without taking up too much space, ideal for compact electronic devices.

Output Polarity: TRUE

Having a true output polarity ensures accurate signal transmission and compatibility with other components in the system.

Peak Reflow Temperature °C: 235

The high peak reflow temperature tolerance allows for reliable soldering during assembly, ensuring strong and durable connections.

Length: 11.505 mm

The compact length size makes it suitable for applications with size restrictions, enabling a smaller footprint on the PCB.

Technology: ECL

Using ECL technology provides high-speed performance and low power consumption, making it suitable for demanding and energy-efficient applications.

Terminal Form: J BEND

The J bend terminal form facilitates easy installation and secure soldering, providing a reliable connection for long-term operation.

Output Latch/Register: REGISTER

Having an output latch/register feature allows for temporary storage of data or signals, ensuring smooth and efficient transmission within the system.

Nominal Supply Voltage: 5 V

Operating at a nominal supply voltage of 5V ensures compatibility with standard power sources and other devices in the system.

Maximum Delay: 8.3 ns

The low maximum delay time ensures fast signal transmission and minimal latency, crucial for applications requiring real-time data processing.

Terminal Pitch: 1.27 mm

The standard terminal pitch allows for easy connection and compatibility with common PCB layouts, simplifying the integration process.

Interface IC Type: PECL TO TTL TRANSLATOR

The interface IC type provides efficient translation between PECL and TTL signal levels, enabling seamless communication between different parts of the system.

Technical Specifications

Voltage Level Translators MC10H607FN attributes and parameters. Explore more Voltage Level Translators devices from Onsemi

Specs

Maximum Delay:

8.3 ns

Interface IC Type:

JESD-30 Code:

S-PQCC-J28

JESD-609 Code:

e0

Length:

11.505 mm

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

6

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Output Latch/Register:

REGISTER

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC28,.5SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

235

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Sub-Category:

Level Translators

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

11.505 mm

Trade Compliance

MC10H607FN Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20