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MV2109RLRAG

Onsemi

MV2109RLRAG by Onsemi

MV2109RLRAG by Onsemi is a varactor diode with a min quality factor of 200, ideal for high frequency to ultra high frequency applications. It features a nominal capacitance of 33 pF and a max power dissipation of 0.28 W, making it suitable for RF tuning circuits in communication systems.

Median Price

$0.241

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 962 parts In-Stock

1+ parts

-

100+ parts

$0.172

1k+ parts

$0.143

10k+ parts

$0.127

962

-

$0.172

$0.143

$0.127

DigiKey

USA . 962 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

$0.310

10k+ parts

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962

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$0.310

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Distributors (In-Stock)

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Digiode

USA . 542 parts In-Stock

1+ parts

$0.134

100+ parts

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542

$0.134

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Vyrian

USA . 5,204 parts In-Stock

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5,204

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Distributors (Availability)

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Corphita

USA . 508 parts In-Stock

1+ parts

$0.127

100+ parts

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508

$0.127

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Corohmni

South Africa . 305 parts In-Stock

1+ parts

$0.141

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305

$0.141

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AZTECH Wire

Italy . 841 parts In-Stock

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$20.550

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841

$20.550

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TANS Electronics

Latvia . 2,908 parts In-Stock

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2,908

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Problanco Electronics

Mexico . 2,785 parts In-Stock

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2,785

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Kulean Microsystems

USA . 1,842 parts In-Stock

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SupplyDigital Components

Austria . 952 parts In-Stock

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UHIMA Technologies

Türkiye . 401 parts In-Stock

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Overview

Discover endless possibilities with the MV2109RLRAG Varactor Diode by Onsemi. With a minimum Quality Factor of 200 and a frequency band ranging from high frequency to ultra high frequency, this diode is perfect for applications requiring precise variable capacitance. The plastic/epoxy package ensures durability and reliability, while the abrupt diode classification guarantees optimal performance. Trust in Onsemi's reputation for quality and innovation, and unlock the potential of your designs with the MV2109RLRAG Varactor Diode.

Feature Benefit Bullets

Minimum Quality Factor: 200

A high quality factor ensures excellent performance and efficient signal processing, making this varactor diode a reliable choice.

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body provides durability and resistance to environmental factors, increasing the longevity of the diode.

Config: SINGLE

Single configuration simplifies the setup and integration of the varactor diode in electronic circuits, making it easy to use for various applications.

Frequency Band: HIGH FREQUENCY TO ULTRA HIGH FREQUENCY

With the ability to operate in high and ultra-high frequency bands, this varactor diode is suitable for a wide range of wireless communication and RF applications.

Package Shape: ROUND

The round shape of the package ensures uniform distribution of stresses, improving reliability and minimizing the risk of mechanical failure.

No. of Terminals: 2

Having 2 terminals simplifies the connection and installation process, making this varactor diode user-friendly and easy to integrate into circuits.

Package Style (Meter): CYLINDRICAL

The cylindrical package style provides a compact design, saving space in electronic devices and allowing for efficient heat dissipation.

Terminal Finish: TIN SILVER COPPER

The use of tin, silver, and copper terminal finish ensures good conductivity, corrosion resistance, and solderability, enhancing the overall performance of the varactor diode.

Maximum Power Dissipation: 0.28 W

With a maximum power dissipation of 0.28W, this varactor diode can handle high power levels without overheating, ensuring reliable operation in demanding applications.

Nominal Diode Capacitance: 33 pF

The nominal capacitance value of 33 pF enables precise control of the capacitance in the circuit, making this varactor diode suitable for tuning and frequency control applications.

Minimum Breakdown Voltage: 30 V

A minimum breakdown voltage of 30V provides protection against voltage spikes and surges, ensuring the longevity and reliability of the varactor diode.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260°C allows for reliable soldering during the manufacturing process, ensuring secure connections and stable performance of the varactor diode.

Diode Type: VARIABLE CAPACITANCE DIODE

As a variable capacitance diode, this product offers adjustable capacitance levels, allowing for flexible tuning and modulation in electronic circuits and communication systems.

Terminal Form: THROUGH-HOLE

The through-hole terminal form simplifies the assembly process and provides a secure connection, making this varactor diode suitable for through-hole PCB mounting.

Maximum Repetitive Peak Reverse Voltage: 30 V

The maximum repetitive peak reverse voltage of 30V ensures reliable operation and protection against reverse voltage conditions, making this varactor diode a durable and robust choice.

Diode Cap Tolerance: 10 %

With a diode capacitance tolerance of 10%, this varactor diode offers precise and consistent capacitance values, ensuring accurate performance in tuning and modulation applications.

Diode Element Material: SILICON

The use of silicon as the diode element material provides high conductivity, low noise, and excellent thermal stability, enhancing the overall performance and reliability of the varactor diode.

Minimum Diode Capacitance Ratio: 2.5

A minimum capacitance ratio of 2.5 ensures a wide range of capacitive tuning options, making this varactor diode versatile and suitable for a variety of RF and communication applications.

Technical Specifications

Varactor Diodes MV2109RLRAG attributes and parameters. Explore more Varactor Diodes devices from Onsemi

Specs

Additional Features:

HIGH RELIABILITY

Minimum Breakdown Voltage:

30 V

Config:

SINGLE

Diode Cap Tolerance:

10 %

Minimum Diode Capacitance Ratio:

2.5

Nominal Diode Capacitance:

33 pF

Diode Element Material:

SILICON

Frequency Band:

HIGH FREQUENCY TO ULTRA HIGH FREQUENCY

JEDEC-95 Code:

TO-92

JESD-30 Code:

O-PBCY-T2

JESD-609 Code:

e1

No. of Elements:

1

No. of Terminals:

2

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Package Style (Meter):

CYLINDRICAL

Peak Reflow Temperature (C):

260

Maximum Power Dissipation:

.28 W

Qualification:

Not Qualified

Minimum Quality Factor:

200

Maximum Repetitive Peak Reverse Voltage:

30 V

Sub-Category:

Varactors

Surface Mount:

NO

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Position:

Variable Capacitance Diode Classification:

ABRUPT

Trade Compliance

MV2109RLRAG Diodes trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.10.00.80

SB

8541.10.00.80

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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