Loading...

MT9J003D00STMUC2CBC1-200

Onsemi

MT9J003D00STMUC2CBC1-200 by Onsemi

Onsemi's MT9J003D00STMUC2CBC1-200 is a CMOS image sensor with 3856x2764 pixels, 1.67um pixel size, and 48MHz master clock. Ideal for high-resolution imaging applications requiring a digital output interface, it operates b/w -30 to 70 °C with a dynamic range of 65.2dB at a frame rate of 60fps.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,230 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,230

-

-

-

-

Vyrian

USA . 698 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

698

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Kulean Microsystems

USA . 8,278 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,278

-

-

-

-

TANS Electronics

Latvia . 7,875 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,875

-

-

-

-

SupplyDigital Components

Austria . 4,822 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,822

-

-

-

-

Problanco Electronics

Mexico . 4,542 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,542

-

-

-

-

Corphita

USA . 1,146 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,146

-

-

-

-

UHIMA Technologies

Türkiye . 794 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

794

-

-

-

-

Corohmni

South Africa . 327 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

327

-

-

-

-

Overview

Capture stunning images and videos with the MT9J003D00STMUC2CBC1-200 by Onsemi. As a leading manufacturer of image sensors, Onsemi delivers top-quality products that exceed industry standards. This innovative sensor offers unparalleled clarity and detail, making it ideal for a wide range of applications in industries such as automotive, security, and consumer electronics. Experience the value and benefits of this cutting-edge technology, from its high-resolution imaging capabilities to its fast data rate and dynamic range. Elevate your projects with the MT9J003D00STMUC2CBC1-200 and unlock a world of possibilities.

Feature Benefit Bullets

Pixel Size (um) 1.67X1.67

This small pixel size allows for high resolution image capture, making this image sensor ideal for detailed photography or high-definition video recording.

Maximum Supply Voltage 1.9 V

The low maximum supply voltage helps in reducing power consumption and heat generation, improving the overall efficiency of the image sensor.

Master Clock 48 MHz

The high master clock frequency enables fast data processing and transmission, resulting in smooth and seamless image capture.

Body Width 10 inch

The compact body width makes this image sensor suitable for applications where space is limited, allowing for easy integration into various devices.

Sensors or Transducers Type IMAGE SENSOR,CMOS

CMOS sensors offer low power consumption, high sensitivity, and are cost-effective, making them a popular choice for imaging applications.

Package Shape or Style SQUARE

The square package shape provides a symmetrical design, making it easy to align and mount the image sensor accurately in devices.

Minimum Supply Voltage 1.7 V

The low minimum supply voltage ensures stable operation even in low power conditions, enhancing the reliability of the image sensor.

Maximum Operating Temperature 70 °C

With a high maximum operating temperature, this image sensor can withstand heat and perform reliably in various environmental conditions.

Output Range 0.40-1.40V

The wide output range allows for capturing a broad spectrum of colors and tones, enhancing the image quality and detail of the captured images.

Output Type DIGITAL OUTPUT

Digital output simplifies data processing and transmission, making it easier to interface the image sensor with other digital devices or processors.

Minimum Operating Temperature -30 °C

The low minimum operating temperature ensures that this image sensor can function in cold environments, making it suitable for a wide range of applications.

Maximum Operating Current 190 mA

The low maximum operating current helps in reducing power consumption and heat generation, extending the lifespan of the image sensor.

Dynamic Range 65.2 dB

A high dynamic range allows the image sensor to capture both bright and dark areas in a scene with detail, resulting in high-quality images with excellent contrast.

Vertical Pixel 2764

The high vertical pixel count offers increased resolution and detail in vertical aspects of images, enhancing the overall quality of captured pictures or videos.

Data Rate 480 Mbps

A high data rate enables fast and efficient data transfer, ensuring minimal latency in capturing and processing images, which is crucial in dynamic or fast-paced scenarios.

Termination Type SOLDER

Solder termination provides a secure and reliable connection, ensuring stable and consistent performance of the image sensor over time.

Output Interface Type 2-WIRE INTERFACE

The 2-wire interface simplifies the connection and communication with other devices, making integration and data transfer easy and efficient.

Frame Rate 60 fps

A high frame rate of 60 frames per second allows for smooth and fluid video recording, ensuring that fast-moving subjects are captured accurately without motion blur.

Array Type FRAME

The frame array type offers a structured grid of pixels for uniform image capture, resulting in consistent and well-aligned images with improved clarity and sharpness.

Mounting Feature SURFACE MOUNT

The surface mounting feature simplifies the installation and integration of the image sensor onto circuit boards or other surfaces, making it suitable for mass production and manufacturing.

Technical Specifications

Image Sensors MT9J003D00STMUC2CBC1-200 attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

IT ALSO HAVE ANALOG SUPPLY VOLTAGE 2.4-3.1 V, ELECTRONIC ROLLING SHUTTER

Array Type:

FRAME

Body Width:

10 inch

Body Height:

1.25 mm

Body Length/Diameter:

10 mm

Data Rate:

480 Mbps

Dynamic Range:

65.2 dB

Frame Rate:

60 fps

Horizontal Pixel:

3856

Master Clock:

48 MHz

Mounting Feature:

Maximum Operating Current:

190 mA

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-30 Cel

Optical Format (inch):

1

Output Interface Type:

2-WIRE INTERFACE

Output Range:

Output Type:

Package Shape or Style:

Pixel Size (um):

1.67X1.67

Sensors or Transducers Type:

Maximum Supply Voltage:

1.9 V

Minimum Supply Voltage:

1.7 V

Termination Type:

SOLDER

Vertical Pixel:

2764

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 15