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MPS3563RLRAG

Onsemi

MPS3563RLRAG by Onsemi

MPS3563RLRAG by Onsemi is an NPN RF BJT with a max fT of 1500 MHz, ideal for amplifier applications. It has a max IC of 0.05A and operates at up to 150 °C. The package is cylindrical with through-hole terminals, suitable for ultra-high frequency band circuits.

Median Price

$0.092

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Verical

USA . 6,000 parts In-Stock

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-

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$0.086

6,000

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$0.086

Rochester

USA . 2,878 parts In-Stock

1+ parts

-

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$0.092

1k+ parts

$0.077

10k+ parts

$0.068

2,878

-

$0.092

$0.077

$0.068

DigiKey

USA . 2,878 parts In-Stock

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$0.120

2,878

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$0.120

Distributors (In-Stock)

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Vyrian

USA . 574 parts In-Stock

1+ parts

$0.063

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574

$0.063

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Digiode

USA . 96 parts In-Stock

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$0.072

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96

$0.072

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DigiKey Marketplace

USA . 6,000 parts In-Stock

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6,000

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Distributors (Availability)

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Corohmni

South Africa . 303 parts In-Stock

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$0.063

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303

$0.063

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Corphita

USA . 377 parts In-Stock

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$0.068

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377

$0.068

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QUARKTWIN TECHNOLOGY LTD

USA . 25,722 parts In-Stock

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SupplyDigital Components

Austria . 7,985 parts In-Stock

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7,985

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Kulean Microsystems

USA . 7,795 parts In-Stock

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7,795

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TANS Electronics

Latvia . 7,313 parts In-Stock

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7,313

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Problanco Electronics

Mexico . 6,626 parts In-Stock

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6,626

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Continental Prestige Electronics

USA . 6,000 parts In-Stock

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$0.069

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6,000

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$0.069

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UHIMA Technologies

Türkiye . 411 parts In-Stock

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411

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Overview

Enhance your electronic designs with the MPS3563RLRAG by Onsemi, a top-quality RF Small Signal BJT. Manufactured by Onsemi, a leading name in semiconductor solutions, this NPN transistor offers superior performance in amplifier applications. With a high transition frequency of 1500 MHz and a maximum operating temperature of 150 °C, this transistor ensures reliability and efficiency in ultra-high-frequency band circuits. Trust Onsemi's expertise and elevate your projects with the MPS3563RLRAG for unparalleled value and performance.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body material provides durability and protection for the transistor, making it suitable for a variety of applications and environments.

Polarity or Channel Type: NPN

NPN transistors are commonly used in amplifier circuits, making this transistor suitable for amplifier applications.

Configuration: SINGLE

The single configuration simplifies circuit design and makes the transistor easy to use in amplifier applications.

Transistor Application: AMPLIFIER

Specifically designed for amplifier applications, ensuring optimal performance in amplification tasks.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide a secure and reliable connection in circuit boards, ensuring stable performance.

Maximum Operating Temperature: 150 °C

With a maximum operating temperature of 150 °C, this transistor can withstand high temperatures without sacrificing performance.

Maximum Collector-Emitter Voltage: 12 V

Offers a high collector-emitter voltage rating, making it suitable for applications that require a higher voltage.

Nominal Transition Frequency (fT): 1500 MHz

With a high transition frequency, this transistor is capable of handling high-frequency signals, making it ideal for applications in the ultra-high-frequency band.

Technical Specifications

RF Small Signal Bipolar Junction Transistors (BJT) MPS3563RLRAG attributes and parameters. Explore more RF Small Signal Bipolar Junction Transistors (BJT) devices from Onsemi

Specs

Maximum Collector Current (IC):

Maximum Collector-Base Capacitance:

1.7 pF

Maximum Collector-Emitter Voltage:

12 V

Configuration:

Minimum DC Current Gain (hFE):

20

Highest Frequency Band:

ULTRA HIGH FREQUENCY BAND

JEDEC-95 Code:

TO-92

JESD-30 Code:

O-PBCY-T3

JESD-609 Code:

e1

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

ROUND

Package Style (Meter):

CYLINDRICAL

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

NPN

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

Other Transistors

Surface Mount:

NO

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

THROUGH-HOLE

Terminal Position:

BOTTOM

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Nominal Transition Frequency (fT):

Trade Compliance

MPS3563RLRAG Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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