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MJE5730

Onsemi

MJE5730 by Onsemi

MJE5730 by Onsemi is a PNP BJT transistor with 300V VCEO, 1A IC, and 40W Ptot. Ideal for switching applications, it has a hFE of 10 and operates up to 140 °C. Its through-hole package style makes it suitable for various electronic designs.

Median Price

$7.650

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (In-Stock)

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American Microsemiconductor Inc.

USA . 26 parts In-Stock

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$7.650

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Q Components

USA . 1,800 parts In-Stock

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ECAB

Sweden . 1,650 parts In-Stock

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Digiode

USA . 1,508 parts In-Stock

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Vyrian

USA . 972 parts In-Stock

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972

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R&J Components

USA . 200 parts In-Stock

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200

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Elcom Components

USA . 88 parts In-Stock

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EMSNET

USA . 61 parts In-Stock

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ComSIT Distribution GmbH

Germany . 50 parts In-Stock

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LittleDiode

UK . 41 parts In-Stock

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Distributors (Availability)

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Component Stockers USA

USA . 1,709 parts In-Stock

1+ parts

$1.720

100+ parts

$1.630

1k+ parts

$1.580

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1,709

$1.720

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Corohmni

South Africa . 191 parts In-Stock

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$7.650

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Kulean Microsystems

USA . 7,380 parts In-Stock

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TANS Electronics

Latvia . 4,648 parts In-Stock

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Problanco Electronics

Mexico . 3,837 parts In-Stock

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SupplyDigital Components

Austria . 3,015 parts In-Stock

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Corphita

USA . 1,742 parts In-Stock

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UHIMA Technologies

Türkiye . 221 parts In-Stock

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Overview

Get ready to experience top-notch performance and reliability with the MJE5730 by Onsemi. As a leading manufacturer in the industry, Onsemi delivers exceptional quality power bipolar junction transistors like this PNP transistor designed for switching applications. With a maximum collector-emitter voltage of 300V and a maximum power dissipation of 40W, this transistor offers unmatched value and benefits to customers. Whether you're looking to enhance the efficiency of your electronic devices or streamline your power management systems, the MJE5730 is the perfect solution for all your needs. Upgrade to Onsemi's superior technology today and see the difference for yourself!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body material makes the transistor lightweight and durable, making it suitable for various applications.

Polarity or Channel Type: PNP

The PNP configuration allows for easy integration into existing circuits where PNP transistors are needed.

Configuration: SINGLE

The single configuration simplifies circuit design and makes it easier to work with for applications requiring a single transistor.

Transistor Application: SWITCHING

Designed for switching applications, this transistor can quickly turn on and off, making it suitable for applications that require rapid switching.

Maximum Power Dissipation (Abs): 40 W

With a high maximum power dissipation, this transistor can handle significant power loads without overheating, ensuring reliability in high-power applications.

Maximum Collector-Emitter Voltage: 300 V

The high maximum collector-emitter voltage allows for use in applications where high voltages are present, ensuring the transistor can withstand the required voltage levels.

Maximum Collector Current (IC): 1 A

The high maximum collector current rating allows the transistor to handle higher current levels, making it suitable for applications with higher current requirements.

Nominal Transition Frequency (fT): 10 MHz

With a high nominal transition frequency, this transistor can switch at high speeds, making it suitable for high-frequency applications.

Technical Specifications

Power Bipolar Junction Transistors (BJT) MJE5730 attributes and parameters. Explore more Power Bipolar Junction Transistors (BJT) devices from Onsemi

Specs

Additional Features:

LEADFORM OPTIONS ARE AVAILABLE

Case Connection:

COLLECTOR

Maximum Collector Current (IC):

1 A

Maximum Collector-Emitter Voltage:

300 V

Configuration:

Minimum DC Current Gain (hFE):

10

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e0

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

140 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

235

Polarity or Channel Type:

PNP

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

Other Transistors

Surface Mount:

NO

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Nominal Transition Frequency (fT):

Trade Compliance

MJE5730 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.29.00.95

SB

8541.29.00.80

NSN

5961-01-455-6271, 5961014556271

NIIN

014556271

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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