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MJE5740

Onsemi

MJE5740 by Onsemi

MJE5740 by Onsemi is a NPN Power BJT with 300V VCEO, 8A IC, and 2W Ptot. It features a built-in diode and resistor in a plastic package. Ideal for switching applications due to its high DC current gain of 200 (hFE).

Median Price

$2.800

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DF Sales Co.

USA . 1,182 parts In-Stock

1+ parts

$1.750

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1,182

$1.750

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DF Sales Co.

USA . 839 parts In-Stock

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$1.750

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839

$1.750

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Component Electronics Inc.

Canada . 195 parts In-Stock

1+ parts

$3.850

100+ parts

$2.880

1k+ parts

$2.500

10k+ parts

-

195

$3.850

$2.880

$2.500

-

American Microsemiconductor Inc.

USA . 1 parts In-Stock

1+ parts

$11.450

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1

$11.450

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Digiode

USA . 234 parts In-Stock

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234

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Vyrian

USA . 188 parts In-Stock

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188

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Electronic Expediters

USA . 77 parts In-Stock

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77

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Resion

USA . 48 parts In-Stock

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48

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Q Components

USA . 30 parts In-Stock

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30

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Nova Conductors

Japan . 10 parts In-Stock

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10

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A2Z Electronics, Inc.

USA . 7 parts In-Stock

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7

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Bristol Electronics

USA . 7 parts In-Stock

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7

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 248 parts In-Stock

1+ parts

$1.750

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248

$1.750

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Ampacity Inc.

Singapore . 826 parts In-Stock

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$33.050

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826

$33.050

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SupplyDigital Components

Austria . 6,394 parts In-Stock

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6,394

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Problanco Electronics

Mexico . 5,825 parts In-Stock

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5,825

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Kulean Microsystems

USA . 5,341 parts In-Stock

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5,341

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Authorized Procurement Solutions

USA . 2,800 parts In-Stock

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2,800

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TANS Electronics

Latvia . 1,630 parts In-Stock

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1,630

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Corphita

USA . 405 parts In-Stock

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405

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UHIMA Technologies

Türkiye . 310 parts In-Stock

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310

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Aranea Global

USA . 50 parts In-Stock

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50

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Overview

Elevate your power switching applications with the MJE5740 by Onsemi. Crafted with precision and quality, this NPN Darlington transistor offers a seamless performance that exceeds expectations. With a maximum collector-emitter voltage of 300V and a maximum operating temperature of 150°C, this transistor is designed to handle high-power applications with ease. Whether you're looking to amplify or switch signals, the MJE5740 delivers outstanding reliability and efficiency. Trust Onsemi for top-notch products that elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material

Provides good insulation and protection for the transistor, ensuring reliable performance.

Polarity or Channel Type

NPN transistors are commonly used in amplification and switching applications, making this product versatile.

Configuration

The Darlington configuration provides high current gain and built-in diode and resistor offer added protection and functionality.

Transistor Application

Designed specifically for switching applications, ensuring efficient and reliable performance.

Package Shape

Rectangular shape makes it easy to mount and integrate into electronic circuits.

Maximum Power Dissipation (Abs)

With a maximum power dissipation of 2W, this transistor can handle high power levels effectively.

Maximum Collector-Emitter Voltage

Can handle high voltage levels, suitable for a variety of applications.

Maximum Collector Current (IC)

With a maximum collector current of 8A, this transistor is capable of handling high current loads.

Technical Specifications

Power Bipolar Junction Transistors (BJT) MJE5740 attributes and parameters. Explore more Power Bipolar Junction Transistors (BJT) devices from Onsemi

Specs

Case Connection:

COLLECTOR

Maximum Collector Current (IC):

8 A

Maximum Collector-Emitter Voltage:

300 V

Minimum DC Current Gain (hFE):

200

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e0

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

235

Polarity or Channel Type:

NPN

Maximum Power Dissipation (Abs):

2 W

Qualification:

Not Qualified

Sub-Category:

Other Transistors

Surface Mount:

NO

Terminal Finish:

TIN LEAD

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

MJE5740 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.29.00.95

SB

8541.29.00.80

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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