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MC10EP105FAG

Onsemi

MC10EP105FAG by Onsemi

MC10EP105FAG by Onsemi is a logic gate with 4 functions and 2 inputs. It operates at a nominal voltage of 3.3V and has a propagation delay of 0.35 ns. Ideal for industrial applications requiring high-speed signal processing in a compact form factor.

Median Price

$21.176

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 214 parts In-Stock

1+ parts

$24.190

100+ parts

$16.924

1k+ parts

$15.924

10k+ parts

-

214

$24.190

$16.924

$15.924

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Chip1Stop

Japan . 29 parts In-Stock

1+ parts

$73.600

100+ parts

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29

$73.600

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Rochester

USA . 10,311 parts In-Stock

1+ parts

-

100+ parts

$14.530

1k+ parts

$13.000

10k+ parts

$12.230

10,311

-

$14.530

$13.000

$12.230

Verical

USA . 3,288 parts In-Stock

1+ parts

-

100+ parts

$18.163

1k+ parts

$16.250

10k+ parts

$15.287

3,288

-

$18.163

$16.250

$15.287

Flip Electronics (Authorized)

USA . 500 parts In-Stock

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500

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Distributors (In-Stock)

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Digiode

USA . 173 parts In-Stock

1+ parts

$15.333

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-

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173

$15.333

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Vyrian

USA . 8,410 parts In-Stock

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8,410

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Flip Electronics

USA . 5,750 parts In-Stock

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5,750

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Elcom Components

USA . 97 parts In-Stock

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97

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Zilex Electronics Inc.

Canada . 15 parts In-Stock

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15

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Electronics Depot

USA . 5 parts In-Stock

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5

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Distributors (Availability)

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Corphita

USA . 1,444 parts In-Stock

1+ parts

$14.526

100+ parts

-

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10k+ parts

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1,444

$14.526

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Corohmni

South Africa . 486 parts In-Stock

1+ parts

$16.140

100+ parts

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486

$16.140

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Continental Prestige Electronics

USA . 10,311 parts In-Stock

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10,311

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SupplyDigital Components

Austria . 6,820 parts In-Stock

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6,820

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TANS Electronics

Latvia . 3,305 parts In-Stock

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3,305

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Kulean Microsystems

USA . 2,060 parts In-Stock

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2,060

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Problanco Electronics

Mexico . 1,388 parts In-Stock

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1,388

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Perfect Parts

USA . 1,203 parts In-Stock

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1,203

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GreenTree Electronics

Israel . 279 parts In-Stock

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279

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4 Star Electronics, Inc. (Excess)

USA . 102 parts In-Stock

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102

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Kepictronics

USA . 40 parts In-Stock

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40

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UHIMA Technologies

Türkiye . 35 parts In-Stock

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35

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Overview

Experience the cutting-edge technology of the MC10EP105FAG by Onsemi, a top-tier manufacturer known for delivering high-quality logic gates. This versatile product offers customers seamless integration, enhanced functionality, and superior performance in a wide range of applications. With its sleek design and advanced features, this logic gate provides unmatched value and benefits, making it a must-have component for your next project. Trust Onsemi to deliver excellence every time.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the logic gates.

Surface Mount: YES

Allows for easy and secure mounting onto circuit boards.

No. of Functions: 4

Provides versatility and allows for multiple logical operations to be performed in one component.

No. of Inputs: 2

Allows for simple logic operations with two input signals.

Nominal Supply Voltage / Vsup (V): 3.3

Operates at a standard voltage level, making it compatible with many systems.

Propagation Delay (tpd): 0.35 ns

Offers high-speed operation for time-critical applications.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures, making it suitable for industrial environments.

Technology: ECL

Utilizes Emitter-Coupled Logic technology for high-speed and low-power operation.

Technical Specifications

Logic Gates MC10EP105FAG attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Additional Features:

NECL MODE: VCC = 0V WITH VEE = -3V TO -5.5V

Family:

10E

JESD-30 Code:

S-PQFP-G32

JESD-609 Code:

e3

Length:

7 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

2

No. of Functions:

4

No. of Inputs:

2

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP32,.35SQ,32

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Packing Method:

TRAY

Peak Reflow Temperature (C):

260

Power Supplies (V):

-5.2

Propagation Delay (tpd):

.35 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.6 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Trade Compliance

MC10EP105FAG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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