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CD4049UBDR

Texas Instruments

CD4049UBDR by Texas Instruments

CD4049UBDR by Texas Instruments is a CMOS logic gate with 6 functions, 120 ns propagation delay at 10V. It operates in temperatures from -55 to 125°C and has a max power supply current of 0.6 mA. Ideal for military-grade applications requiring high-speed signal processing in compact spaces.

Median Price

$0.283

Lifecycle Status

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24

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1k+

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Arrow

USA . 5 parts In-Stock

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Texas Instruments

USA . 94,461 parts In-Stock

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Mouser Electronics

USA . 3,534 parts In-Stock

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$0.285

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$0.285

Adafruit Industries

USA . 93 parts In-Stock

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DigiKey

USA . 4,192 parts In-Stock

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Chip1Stop

Japan . 1,430 parts In-Stock

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Verical

USA . 355 parts In-Stock

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Ozdisan Elektronik

Türkiye . 5,739 parts In-Stock

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Nova Conductors

Japan . 10 parts In-Stock

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Digiode

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Galco

USA . 4 parts In-Stock

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TME

Poland . 1,186 parts In-Stock

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Maritex

Poland . 6,819 parts In-Stock

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Chip Stock

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Bristol Electronics

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Vyrian

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Sensible Micro Corp

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NAC Semi

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Cyclops Electronics Ltd

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ACDS - Activité Composants Distribution Service

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Atlantic Semiconductor

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ComSIT Distribution GmbH

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Magnum Semiconductors LLP

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Prism Electronics

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Semicontronic

India . 19,943 parts In-Stock

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Continental Prestige Electronics

USA . 3,334 parts In-Stock

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Netroflash

USA . 1,000 parts In-Stock

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Argo Parts USA

USA . 723 parts In-Stock

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Corphita

USA . 2,440 parts In-Stock

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Microchip USA

USA . 9,549 parts In-Stock

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Advanced Electronics

New Zealand . 93 parts In-Stock

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Corohmni

South Africa . 152 parts In-Stock

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Parana Technologies

USA . 554 parts In-Stock

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DigiPath Technology Company

USA . 611 parts In-Stock

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ChromeModa Solutions

Germany . 1,855 parts In-Stock

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IDEA Electronic Components Group

UK . 827 parts In-Stock

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Perfect Parts

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QUARKTWIN TECHNOLOGY LTD

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Metaverse IC Inc.

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Authorized Procurement Solutions

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GreenTree Electronics

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A-Z Elektronik GmbH

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Glotronic Ltd.

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Alle Elektronik GmbH

Germany . 3,659 parts In-Stock

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Lixinc

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Cyclops Electronics Ltd (Excess)

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Overview

Discover the power of Texas Instruments with the CD4049UBDR Logic Gates. This high-quality product offers reliability and efficiency, making it a must-have for various applications. From industrial to consumer electronics, this versatile component delivers exceptional performance at a competitive price point. Upgrade your projects with Texas Instruments and experience the difference in quality and value. Choose the CD4049UBDR for unmatched results every time.

Feature Benefit Bullets

Propagation Delay at Nominal Supply: 120 ns

Fast propagation delay ensures efficient and quick processing of signals, making this product suitable for high-speed applications.

No. of Functions: 6

Having multiple functions in one package reduces the need for multiple components, leading to a more compact and streamlined design.

Nominal Supply Voltage (Vsup): 10V

Operating at a standard voltage level makes it compatible with various systems and reduces the need for additional voltage regulation circuitry.

Temperature Grade: MILITARY

Being designed for military-grade applications ensures high reliability, durability, and performance in extreme environmental conditions.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and compatibility with various digital systems, making it a versatile choice.

Technical Specifications

Logic Gates CD4049UBDR attributes and parameters. Explore more Logic Gates devices from Texas Instruments

Specs

Family:

4000/14000/40000

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

9.9 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

18 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

6

No. of Inputs:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

5/15

Maximum Power Supply Current (ICC):

.6 mA

Propagation Delay At Nominal Supply:

120 ns

Propagation Delay (tpd):

120 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.75 mm

Sub-Category:

Gate

Maximum Supply Voltage (Vsup):

15 V

Minimum Supply Voltage (Vsup):

5 V

Nominal Supply Voltage / Vsup (V):

10

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3.9 mm

Trade Compliance

CD4049UBDR Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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