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MC10EL12DTG

Onsemi

MC10EL12DTG by Onsemi

MC10EL12DTG by Onsemi is a Logic Gate with 2 inputs, 0.45 ns propagation delay, and operates at -40 to 85 °C. It is used in industrial applications requiring ECL technology for high-speed signal processing in a compact 8-terminal package.

Median Price

$2.969

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 39,320 parts In-Stock

1+ parts

-

100+ parts

$2.800

1k+ parts

$2.510

10k+ parts

$2.360

39,320

-

$2.800

$2.510

$2.360

Verical

USA . 10,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$3.138

10k+ parts

$2.950

10,500

-

-

$3.138

$2.950

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,357 parts In-Stock

1+ parts

$2.964

100+ parts

-

1k+ parts

-

10k+ parts

-

1,357

$2.964

-

-

-

Vyrian

USA . 5,887 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,887

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,220 parts In-Stock

1+ parts

$2.808

100+ parts

-

1k+ parts

-

10k+ parts

-

2,220

$2.808

-

-

-

Corohmni

South Africa . 299 parts In-Stock

1+ parts

$3.120

100+ parts

-

1k+ parts

-

10k+ parts

-

299

$3.120

-

-

-

Component Stockers USA

USA . 57,750 parts In-Stock

1+ parts

$3.190

100+ parts

$2.990

1k+ parts

$2.700

10k+ parts

$2.700

57,750

$3.190

$2.990

$2.700

$2.700

AZTECH Wire

Italy . 81 parts In-Stock

1+ parts

$15.370

100+ parts

-

1k+ parts

-

10k+ parts

-

81

$15.370

-

-

-

Advanced Electronics

New Zealand . 1,000 parts In-Stock

1+ parts

$35.040

100+ parts

$31.886

1k+ parts

$28.733

10k+ parts

-

1,000

$35.040

$31.886

$28.733

-

Continental Prestige Electronics

USA . 39,320 parts In-Stock

1+ parts

-

100+ parts

$2.710

1k+ parts

-

10k+ parts

-

39,320

-

$2.710

-

-

TANS Electronics

Latvia . 6,755 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,755

-

-

-

-

Kulean Microsystems

USA . 6,249 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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6,249

-

-

-

-

Microchip USA

USA . 4,042 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,042

-

-

-

-

SupplyDigital Components

Austria . 3,424 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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3,424

-

-

-

-

Problanco Electronics

Mexico . 826 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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826

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-

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UHIMA Technologies

Türkiye . 42 parts In-Stock

1+ parts

-

100+ parts

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42

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Overview

Discover the power of the MC10EL12DTG logic gate by Onsemi, a cutting-edge solution designed for high-speed applications. With a focus on quality and reliability, Onsemi delivers top-of-the-line products that meet industry standards. Perfect for industrial settings, this logic gate offers unparalleled performance with a fast propagation delay of 0.45 ns and a wide operating temperature range. Experience seamless integration and improved efficiency with the MC10EL12DTG, setting a new standard in logic gates. Upgrade your system today and unlock endless possibilities with Onsemi.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material offers good durability and protection for the internal components of the logic gate, making it suitable for various environmental conditions.

Surface Mount: YES

Surface mount capability allows for easy and convenient installation on circuit boards, saving space and reducing assembly time.

No. of Inputs: 2

Having 2 inputs provides flexibility for designing logic circuits with different input configurations.

Nominal Supply Voltage / Vsup (V): 5

Operating at a nominal supply voltage of 5V ensures compatibility with standard power sources and logic circuits.

Propagation Delay (tpd): 0.45 ns

Low propagation delay of 0.45ns ensures fast signal processing and high-speed operation, making it ideal for time-critical applications.

Maximum Operating Temperature: 85 °C

High maximum operating temperature of 85 °C allows for reliable performance in harsh industrial environments.

Technology: ECL

ECL technology offers high-speed and low power consumption, making this logic gate suitable for high-performance applications.

Technical Specifications

Logic Gates MC10EL12DTG attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Additional Features:

NECL MODE: VCC = 0V WITH VEE = -4.2V TO -5.7V

Family:

10EL

JESD-30 Code:

S-PDSO-G8

JESD-609 Code:

e3

Length:

3 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Inputs:

2

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.19

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

-5.2

Propagation Delay (tpd):

.45 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Other Logic ICs

Maximum Supply Voltage (Vsup):

5.7 V

Minimum Supply Voltage (Vsup):

4.2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3 mm

Trade Compliance

MC10EL12DTG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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