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MC10E457FNR2G

Onsemi

MC10E457FNR2G by Onsemi

MC10E457FNR2G by Onsemi is a 3-function, 2-input multiplexer with 0.7 ns propagation delay. Operating at -5.2V to 5V, it's ideal for high-speed applications requiring complementary output polarity in a square chip carrier package.

Median Price

$6.244

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 5,974 parts In-Stock

1+ parts

-

100+ parts

$5.550

1k+ parts

$4.960

10k+ parts

$4.670

5,974

-

$5.550

$4.960

$4.670

Verical

USA . 2,580 parts In-Stock

1+ parts

-

100+ parts

$6.938

1k+ parts

$6.200

10k+ parts

-

2,580

-

$6.938

$6.200

-

Distributors (In-Stock)

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Digiode

USA . 165 parts In-Stock

1+ parts

$5.871

100+ parts

-

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-

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165

$5.871

-

-

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Component Electronics Inc.

Canada . 24 parts In-Stock

1+ parts

$8.460

100+ parts

$6.350

1k+ parts

$5.500

10k+ parts

-

24

$8.460

$6.350

$5.500

-

Vyrian

USA . 8,355 parts In-Stock

1+ parts

-

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8,355

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ACDS - Activité Composants Distribution Service

France . 260 parts In-Stock

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260

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Distributors (Availability)

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Benley Electronics

USA . 4 parts In-Stock

1+ parts

$2.000

100+ parts

-

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4

$2.000

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Corohmni

South Africa . 487 parts In-Stock

1+ parts

$5.350

100+ parts

-

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487

$5.350

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-

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Corphita

USA . 256 parts In-Stock

1+ parts

$5.562

100+ parts

-

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256

$5.562

-

-

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AZTECH Wire

Italy . 840 parts In-Stock

1+ parts

$10.030

100+ parts

-

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840

$10.030

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QUARKTWIN TECHNOLOGY LTD

USA . 19,833 parts In-Stock

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19,833

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TANS Electronics

Latvia . 8,183 parts In-Stock

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8,183

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Continental Prestige Electronics

USA . 5,974 parts In-Stock

1+ parts

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100+ parts

$5.350

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5,974

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$5.350

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Microchip USA

USA . 4,340 parts In-Stock

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4,340

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SupplyDigital Components

Austria . 3,627 parts In-Stock

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3,627

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Problanco Electronics

Mexico . 1,299 parts In-Stock

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1,299

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UHIMA Technologies

Türkiye . 960 parts In-Stock

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960

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Authorized Procurement Solutions

USA . 415 parts In-Stock

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415

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Kulean Microsystems

USA . 293 parts In-Stock

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293

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Overview

Boost your electronic designs with the MC10E457FNR2G by Onsemi, a high-quality multiplexer & demultiplexer that offers unparalleled performance and reliability. With Onsemi's reputation for excellence in semiconductor manufacturing, you can trust that this product will meet your expectations. Perfect for a wide range of applications, this chip carrier package ensures seamless integration into your projects. Experience the benefits of fast propagation delay, low power consumption, and versatile terminal options. Upgrade your designs with the MC10E457FNR2G and take your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material is lightweight and durable, making the product easy to handle and resistant to damage.

Surface Mount: YES

Surface mount technology allows for easy installation and compact design, saving space on a circuit board.

No. of Functions: 3

Having multiple functions in one device increases efficiency and reduces the need for additional components.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard supply voltage of 5V ensures compatibility with a wide range of applications.

Propagation Delay (tpd): 0.7 ns

The low propagation delay ensures fast and reliable signal processing.

Maximum Operating Temperature: 85 °C

The high operating temperature range allows for use in various environmental conditions.

Output Characteristics: OPEN-EMITTER

Open-emitter outputs provide flexibility in connecting to different types of circuits.

Technology: ECL

ECL technology offers high-speed performance and low power consumption.

Terminal Pitch: 1.27 mm

The small terminal pitch enables dense packing of components and efficient use of PCB space.

Maximum Power Supply Current (ICC): 110 mA

The device can handle a relatively high power supply current, suitable for demanding applications.

Technical Specifications

Multiplexer & Demultiplexer MC10E457FNR2G attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Onsemi

Specs

Additional Features:

NECL MODE OPERATING RANGE: VEE = -4.2 V TO -5.7 V WITH VCC = 0 V

Family:

10E

JESD-30 Code:

S-PQCC-J28

JESD-609 Code:

e3

Length:

11.505 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

3

No. of Functions:

3

No. of Inputs:

2

No. of Outputs:

1

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

OPEN-EMITTER

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC28,.5SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

-5.2

Maximum Power Supply Current (ICC):

110 mA

Propagation Delay (tpd):

.7 ns

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Sub-Category:

Multiplexer/Demultiplexers

Maximum Supply Voltage (Vsup):

5.7 V

Minimum Supply Voltage (Vsup):

4.2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

11.505 mm

Trade Compliance

MC10E457FNR2G Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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