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MC100E171FNR2

Onsemi

MC100E171FNR2 by Onsemi

MC100E171FNR2 by Onsemi is a 3-function, 4-input multiplexer with 0.65 ns propagation delay at 5V. It operates in the temperature range of 0-85 °C and has a terminal pitch of 1.27mm. Ideal for high-speed data communication applications.

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Component Stockers USA

USA . 477 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 18,742 parts In-Stock

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TANS Electronics

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SupplyDigital Components

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Microchip USA

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Problanco Electronics

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Corphita

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Kulean Microsystems

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Türkiye . 813 parts In-Stock

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Overview

Upgrade your electronics with the MC100E171FNR2 by Onsemi, a high-quality Multiplexer & Demultiplexer. Onsemi is a trusted manufacturer known for its cutting-edge technology and reliable products. This versatile device offers fast propagation delay, low power consumption, and a compact chip carrier package. Ideal for applications requiring precise signal routing and data processing, this multiplexer/demultiplexer provides exceptional performance at a competitive price point. Elevate your projects with the MC100E171FNR2 and experience enhanced efficiency and functionality like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and protection for the internal components of the multiplexer/demultiplexer.

Propagation Delay At Nominal Supply: 0.65 ns

Low propagation delay ensures fast and efficient signal processing, making this product suitable for high-speed applications.

Surface Mount: YES

Surface mount capability allows for easy and efficient PCB assembly, saving time and effort during manufacturing.

No. of Functions: 3

Having multiple functions in a single device helps in simplifying circuit designs and reducing component count, leading to cost savings.

No. of Inputs: 4

Having multiple inputs allows for versatile signal routing capabilities, making this product suitable for complex data processing applications.

Nominal Supply Voltage / Vsup (V): 5

Operates at a standard nominal supply voltage of 5V, ensuring compatibility with common power sources in electronic systems.

Power Supplies (V): -4.5

Supports negative power supplies, enabling flexibility in system design and integration of different power requirements.

Package Style (Meter): CHIP CARRIER

Chip carrier package style offers compact form factor and efficient heat dissipation, making it suitable for space-constrained applications.

Output Characteristics: OPEN-EMITTER

Open-emitter output characteristics provide flexibility in signal interface options, allowing for easy integration with different circuit configurations.

Technology: ECL

Utilizes ECL technology known for its high-speed operation and low power consumption, making it ideal for applications requiring fast signal processing.

Technical Specifications

Multiplexer & Demultiplexer MC100E171FNR2 attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Onsemi

Specs

Additional Features:

NECL MODE OPERATING RANGE: VEE = -4.2 V TO -5.5 V WITH VCC = 0 V

Family:

100E

JESD-30 Code:

S-PQCC-J28

JESD-609 Code:

e0

Length:

11.505 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Functions:

3

No. of Inputs:

4

No. of Outputs:

1

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

OPEN-EMITTER

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC28,.5SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Packing Method:

TR

Peak Reflow Temperature (C):

235

Power Supplies (V):

-4.5

Maximum Power Supply Current (ICC):

77 mA

Propagation Delay At Nominal Supply:

.65 ns

Propagation Delay (tpd):

.65 ns

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Sub-Category:

Multiplexer/Demultiplexers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

11.505 mm

Trade Compliance

MC100E171FNR2 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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