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MC100E171FN

Onsemi

MC100E171FN by Onsemi

MC100E171FN by Onsemi is a 3-function, 4-input multiplexer with 0.65 ns propagation delay at 5V. Ideal for high-speed applications, it operates b/w 0-85 °C and has a terminal pitch of 1.27mm in a square chip carrier package.

Median Price

$3.970

Lifecycle Status

Suppliers In-Stock

24

In-Stock Inventory

1k+

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Rochester

USA . 354 parts In-Stock

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$3.430

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$3.070

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$2.890

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$2.890

DigiKey

USA . 354 parts In-Stock

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$3.970

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Verical

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$4.287

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Freelance Electronics

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Digiode

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Vyrian

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American Microsemiconductor Inc.

USA . 844 parts In-Stock

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Q Components

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ECAB

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Bristol Electronics

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Atlantic Semiconductor

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ComSIT Distribution GmbH

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Electronics Depot

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Elcom Components

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Prism Electronics

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Mentor Electronics Marketing, LLC

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Inland Empire Components Inc.

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Semtec, LLC

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R&J Components

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ACDS - Activité Composants Distribution Service

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Cyclops Electronics Ltd

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Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

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Resion

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Corohmni

South Africa . 271 parts In-Stock

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Ampacity Inc.

Singapore . 215 parts In-Stock

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$3.250

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Corphita

USA . 1,195 parts In-Stock

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Kulean Microsystems

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SupplyDigital Components

Austria . 6,235 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

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TANS Electronics

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Problanco Electronics

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Authorized Procurement Solutions

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UHIMA Technologies

Türkiye . 976 parts In-Stock

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Metaverse IC Inc.

Canada . 693 parts In-Stock

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Microchip USA

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Continental Prestige Electronics

USA . 354 parts In-Stock

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Perfect Parts

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Assy Fe

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Overview

Unlock unparalleled efficiency and performance with the MC100E171FN by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-notch quality and reliability in their products. The MC100E171FN, a versatile multiplexer & demultiplexer, offers seamless integration and superior functionality for a wide range of applications. Experience lightning-fast propagation delay, high precision outputs, and exceptional temperature resilience. Elevate your projects with the unmatched value and benefits that the MC100E171FN brings to the table.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection for the internal components, ensuring a longer lifespan for the product.

No. of Functions: 3

Having multiple functions in a single device helps in reducing the overall system complexity and board space requirement, making it a cost-effective and efficient choice.

Nominal Supply Voltage / Vsup (V): 5

The product operates at a standard voltage of 5V, making it compatible with a wide range of systems and easy to integrate into existing setups.

Output Characteristics: OPEN-EMITTER

Open-emitter output allows for flexibility in connecting external circuits, enabling customization and adaptability to different system requirements.

Technology: ECL

ECL (Emitter-Coupled Logic) technology offers high-speed operation and low power consumption, making the product suitable for applications requiring fast and efficient data processing.

Technical Specifications

Multiplexer & Demultiplexer MC100E171FN attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Onsemi

Specs

Additional Features:

NECL MODE OPERATING RANGE: VEE = -4.2 V TO -5.5 V WITH VCC = 0 V

Family:

100E

JESD-30 Code:

S-PQCC-J28

JESD-609 Code:

e0

Length:

11.505 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Functions:

3

No. of Inputs:

4

No. of Outputs:

1

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

OPEN-EMITTER

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC28,.5SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

235

Power Supplies (V):

-4.5

Maximum Power Supply Current (ICC):

77 mA

Propagation Delay At Nominal Supply:

.65 ns

Propagation Delay (tpd):

.65 ns

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Sub-Category:

Multiplexer/Demultiplexers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

11.505 mm

Trade Compliance

MC100E171FN Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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