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SNC54ALS857JT

Texas Instruments

SNC54ALS857JT by Texas Instruments

SNC54ALS857JT by Texas Instruments is a 6-function multiplexer with 2 inputs, operating at temperatures from -55°C to 125°C. It features a MIL-STD-883 Class B screening level and TTL technology, suitable for military applications. With a nominal voltage of 5V and 24 terminals in an in-line package style, it offers reliable performance in demanding environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,015 parts In-Stock

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Digiode

USA . 2,503 parts In-Stock

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2,503

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,312 parts In-Stock

1+ parts

$3.000

100+ parts

-

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1,312

$3.000

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Parana Technologies

USA . 1,202 parts In-Stock

1+ parts

$16.166

100+ parts

$1,501.255

1k+ parts

$14.549

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1,202

$16.166

$1,501.255

$14.549

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AZTECH Wire

Italy . 682 parts In-Stock

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$17.091

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682

$17.091

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DigiPath Technology Company

USA . 886 parts In-Stock

1+ parts

$17.801

100+ parts

$16.377

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886

$17.801

$16.377

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ChromeModa Solutions

Germany . 2,041 parts In-Stock

1+ parts

$18.164

100+ parts

$14.894

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2,041

$18.164

$14.894

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IDEA Electronic Components Group

UK . 371 parts In-Stock

1+ parts

$18.164

100+ parts

$17.256

1k+ parts

$16.348

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371

$18.164

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$16.348

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Corphita

USA . 2,542 parts In-Stock

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Overview

Experience the superior quality and reliability of Texas Instruments with the SNC54ALS857JT, a high-performance multiplexer & demultiplexer designed to meet the demands of military-grade applications. With 6 functions and 3-state output characteristics, this product offers unmatched value and versatility for your electronic systems. Trust in Texas Instruments for cutting-edge technology and exceptional performance in every project.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic is a reliable and durable material, providing good protection for the internal components of the multiplexer & demultiplexer.

No. of Functions: 6

Having the ability to perform 6 different functions in one unit offers versatility and efficiency in signal routing and switching.

Screening Level: MIL-STD-883 Class B (Modified)

This level of screening ensures high reliability and quality, making the multiplexer & demultiplexer suitable for demanding military applications.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard supply voltage of 5V makes integration into existing systems easy and straightforward.

Output Characteristics: 3-STATE

The 3-state output allows the multiplexer & demultiplexer to have a high impedance state, which can be useful for bus-oriented systems and reducing power consumption.

Technology: TTL

TTL technology offers fast switching speeds and compatibility with a wide range of digital systems, making this multiplexer & demultiplexer versatile and reliable.

Technical Specifications

Multiplexer & Demultiplexer SNC54ALS857JT attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Texas Instruments

Specs

JESD-30 Code:

R-XDIP-T24

Logic IC Type:

No. of Functions:

6

No. of Inputs:

2

No. of Terminals:

24

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Package Body Material:

CERAMIC

Package Code:

DIP

Package Equivalence Code:

DIP24,.3

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Qualification:

Not Qualified

Screening Level:

MIL-STD-883 Class B (Modified)

Sub-Category:

Multiplexer/Demultiplexers

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trade Compliance

SNC54ALS857JT Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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