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SNC54298J

Texas Instruments

SNC54298J by Texas Instruments

SNC54298J by Texas Instruments is a MIL-STD-883 Class B multiplexer with 4 functions, 2 inputs, and operates at -55 to 125°C. It has a supply voltage of 5V, through-hole terminals, and is ideal for military applications requiring TTL technology in ceramic packages.

Median Price

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Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

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Vyrian

USA . 6,712 parts In-Stock

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Digiode

USA . 2,421 parts In-Stock

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Electronic Expediters

USA . 139 parts In-Stock

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LWI Electronics Inc

India . 24 parts In-Stock

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Mil-Aero Solutions, Inc.

USA . 10 parts In-Stock

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Resion

USA . 6 parts In-Stock

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AZTECH Wire

Italy . 499 parts In-Stock

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$8.919

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Parana Technologies

USA . 2,034 parts In-Stock

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$12.065

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$12.474

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DigiPath Technology Company

USA . 1,825 parts In-Stock

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$13.285

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$12.222

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ChromeModa Solutions

Germany . 5,404 parts In-Stock

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$13.556

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$11.116

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IDEA Electronic Components Group

UK . 509 parts In-Stock

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$13.556

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$12.878

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$12.200

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One Stop Electronics

USA . 224 parts In-Stock

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Corphita

USA . 4,844 parts In-Stock

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Kepictronics

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Overview

Elevate your project with the SNC54298J by Texas Instruments, a high-quality multiplexer & demultiplexer designed to deliver top-notch performance and reliability. With Texas Instruments' reputation for excellence in manufacturing, you can trust that this product will meet your expectations. Perfect for a wide range of applications, this versatile device offers unmatched value, benefits, and advantages to customers looking for seamless integration and superior functionality. Experience the difference with the SNC54298J and elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic is a durable and reliable material, making the product more resistant to thermal and mechanical stress, ensuring a longer lifespan.

No. of Functions: 4

Having 4 functions in one device saves space and reduces the need for multiple components, simplifying the circuit design.

Screening Level: MIL-STD-883 Class B (Modified)

This high screening level ensures the product meets stringent military standards for reliability and performance in harsh environments.

No. of Inputs: 2

With 2 inputs, the multiplexer/demultiplexer provides flexibility in routing signals, allowing for various input configurations.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard supply voltage of 5V, this product is compatible with common logic levels, making integration easier.

Maximum Operating Temperature: 125 °C

Being able to operate at temperatures up to 125°C ensures reliability in high-temperature environments, crucial for demanding applications.

Technology: TTL

Using TTL technology ensures fast switching times and compatibility with other TTL devices, making it suitable for high-speed applications.

Technical Specifications

Multiplexer & Demultiplexer SNC54298J attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Texas Instruments

Specs

JESD-30 Code:

R-XDIP-T16

Logic IC Type:

No. of Functions:

4

No. of Inputs:

2

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

5

Qualification:

Not Qualified

Screening Level:

MIL-STD-883 Class B (Modified)

Sub-Category:

Multiplexer/Demultiplexers

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

SNC54298J Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-037-9358, 5962010379358

NIIN

010379358

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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