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SNC54251W

Texas Instruments

SNC54251W by Texas Instruments

SNC54251W by Texas Instruments is a MIL-STD-883 Class B (Modified) multiplexer with 8 inputs and 3-STATE output characteristics. It operates in temperatures ranging from -55°C to 125°C, making it suitable for military-grade applications requiring high reliability and performance. The flatpack package style with ceramic body material ensures durability and robustness in various environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,362 parts In-Stock

1+ parts

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8,362

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Digiode

USA . 4,300 parts In-Stock

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4,300

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 574 parts In-Stock

1+ parts

$7.014

100+ parts

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574

$7.014

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Parana Technologies

USA . 1,829 parts In-Stock

1+ parts

$20.751

100+ parts

$1,927.067

1k+ parts

$18.676

10k+ parts

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1,829

$20.751

$1,927.067

$18.676

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DigiPath Technology Company

USA . 2,171 parts In-Stock

1+ parts

$22.850

100+ parts

$21.022

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2,171

$22.850

$21.022

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IDEA Electronic Components Group

UK . 1,993 parts In-Stock

1+ parts

$23.316

100+ parts

$22.150

1k+ parts

$20.984

10k+ parts

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1,993

$23.316

$22.150

$20.984

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ChromeModa Solutions

Germany . 1,176 parts In-Stock

1+ parts

$23.316

100+ parts

$19.119

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1,176

$23.316

$19.119

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One Stop Electronics

USA . 1,189 parts In-Stock

1+ parts

$57.000

100+ parts

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1,189

$57.000

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Corphita

USA . 4,356 parts In-Stock

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4,356

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Overview

Enhance your electronic projects with the SNC54251W by Texas Instruments, a high-quality multiplexer & demultiplexer designed for military-grade applications. With Texas Instruments' reputation for excellence in semiconductor technology, this component offers reliability and precision in data transmission. Explore the limitless possibilities of this versatile product in aerospace, defense, and communication systems. Upgrade your projects today with the SNC54251W and experience the efficiency and performance that only Texas Instruments can deliver.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic packaging provides excellent thermal conductivity and resistance to high temperatures, making the product durable and reliable for military applications.

Surface Mount: YES

Surface mount technology allows for easier assembly and integration into various electronic systems, saving space and reducing assembly time.

Screening Level: MIL-STD-883 Class B (Modified)

Compliance with MIL-STD-883 Class B standards ensures high reliability and performance in harsh environments, meeting the requirements of military applications.

No. of Inputs: 8

Having 8 inputs allows for versatile signal routing and switching capabilities, making the product suitable for complex communication systems.

Package Shape: RECTANGULAR

Rectangular packaging provides a compact form factor that can easily fit into tight spaces, ideal for applications where size constraints are a concern.

No. of Terminals: 16

With 16 terminals, the product offers multiple connection points for interfacing with other components, facilitating efficient signal transfer and processing.

Package Style (Meter): FLATPACK

The flatpack style offers a low profile design that can be easily mounted and secured within electronic assemblies, enhancing overall system integration.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, the product can withstand elevated heat levels without compromising performance, ensuring long-term reliability in challenging environments.

Output Characteristics: 3-STATE

The 3-state output feature allows for the connection of multiple devices to a single output line, enabling efficient signal multiplexing and demultiplexing in data transmission applications.

Minimum Operating Temperature: -55 °C

The low minimum operating temperature range enables the product to function reliably in extreme cold conditions, making it suitable for deployment in various climates and environments.

Terminal Position: DUAL

Dual terminal positions provide flexibility in mounting and connection options, allowing for versatile installation configurations to meet specific application requirements.

Temperature Grade: MILITARY

Designed to meet military-grade standards, the product offers enhanced ruggedness and reliability, ensuring optimal performance in demanding military applications.

Technology: TTL

Using TTL (transistor-transistor logic) technology provides fast switching speeds and low power consumption, making the product suitable for high-speed digital signal processing applications.

Terminal Form: FLAT

Flat terminal forms offer easy soldering and connection capabilities, simplifying the assembly process and enhancing overall product reliability.

Terminal Pitch: 1.27 mm

With a small terminal pitch, the product enables high-density mounting of components on PCBs, allowing for compact and efficient circuit designs in space-constrained applications.

Technical Specifications

Multiplexer & Demultiplexer SNC54251W attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Texas Instruments

Specs

JESD-30 Code:

R-XDFP-F16

Logic IC Type:

No. of Functions:

1

No. of Inputs:

8

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Package Body Material:

CERAMIC

Package Code:

DFP

Package Equivalence Code:

FL16,.3

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Screening Level:

MIL-STD-883 Class B (Modified)

Sub-Category:

Multiplexer/Demultiplexers

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trade Compliance

SNC54251W Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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