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SNC54157W

Texas Instruments

SNC54157W by Texas Instruments

SNC54157W by Texas Instruments is a MIL-STD-883 Class B multiplexer with 4 functions, 2 inputs, and a propagation delay of 14ns. It operates at temperatures ranging from -55 to 125°C, making it suitable for military-grade applications requiring fast signal switching in compact spaces. With a flatpack style and ceramic package body material, this TTL technology device offers reliable performance in harsh environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,715 parts In-Stock

1+ parts

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7,715

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Digiode

USA . 1,981 parts In-Stock

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1,981

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Electronic Expediters

USA . 3 parts In-Stock

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3

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 541 parts In-Stock

1+ parts

$19.555

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541

$19.555

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Parana Technologies

USA . 2,004 parts In-Stock

1+ parts

$20.516

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$20.587

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2,004

$20.516

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$20.587

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DigiPath Technology Company

USA . 178 parts In-Stock

1+ parts

$22.591

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178

$22.591

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ChromeModa Solutions

Germany . 3,068 parts In-Stock

1+ parts

$23.052

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$18.903

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3,068

$23.052

$18.903

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IDEA Electronic Components Group

UK . 1,697 parts In-Stock

1+ parts

$23.052

100+ parts

$21.899

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$20.747

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1,697

$23.052

$21.899

$20.747

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One Stop Electronics

USA . 183 parts In-Stock

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$59.000

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183

$59.000

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Corphita

USA . 3,025 parts In-Stock

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3,025

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Overview

Elevate your electronic designs with the SNC54157W by Texas Instruments, a top-tier manufacturer known for excellence in the industry. This versatile multiplexer & demultiplexer offers unparalleled quality and reliability, making it a must-have component for various applications. Experience the seamless operation and efficiency this product provides, delivering value and benefits that exceed expectations. Upgrade your projects today with the SNC54157W and unlock a world of possibilities in electronics innovation.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

Provides durability and protection for the internal components, ensuring a longer lifespan.

Surface Mount: YES

Allows for easy installation on circuit boards, saving time and effort.

No. of Functions: 4

Provides versatility and flexibility in signal routing and processing.

Screening Level: MIL-STD-883 Class B (Modified)

Ensures high reliability and quality performance under rigorous testing standards.

Nominal Supply Voltage / Vsup (V): 5

Compatible with standard voltage requirements, making integration seamless.

Propagation Delay (tpd): 14 ns

Offers fast signal processing for efficient data transmission.

Maximum Operating Temperature: 125 °C

Can withstand high temperatures in harsh environments, improving reliability.

Minimum Operating Temperature: -55 °C

Can operate in extremely cold conditions without performance degradation.

Technology: TTL

Utilizes TTL technology for reliable and stable signal processing.

Technical Specifications

Multiplexer & Demultiplexer SNC54157W attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Texas Instruments

Specs

Family:

TTL/H/L

JESD-30 Code:

R-GDFP-F16

Length:

10.2 mm

Logic IC Type:

No. of Functions:

4

No. of Inputs:

2

No. of Outputs:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

TRUE

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DFP

Package Equivalence Code:

FL16,.3

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Propagation Delay (tpd):

14 ns

Qualification:

Not Qualified

Screening Level:

MIL-STD-883 Class B (Modified)

Maximum Seated Height:

2.03 mm

Sub-Category:

Multiplexer/Demultiplexers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

6.73 mm

Trade Compliance

SNC54157W Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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