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SNC54251J

Texas Instruments

SNC54251J by Texas Instruments

SNC54251J by Texas Instruments is a MIL-STD-883 Class B (Modified) rated TTL multiplexer with 8 inputs and 3-STATE output. Operating b/w -55°C to 125°C, it's ideal for military applications requiring high temperature tolerance and reliability in a ceramic package.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,787 parts In-Stock

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5,787

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Digiode

USA . 2,336 parts In-Stock

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A2Z Electronics, Inc.

USA . 9 parts In-Stock

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9

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Distributors (Availability)

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Parana Technologies

USA . 754 parts In-Stock

1+ parts

$7.221

100+ parts

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$7.724

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754

$7.221

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$7.724

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DigiPath Technology Company

USA . 2,083 parts In-Stock

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$7.952

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$7.316

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2,083

$7.952

$7.316

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ChromeModa Solutions

Germany . 2,077 parts In-Stock

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$8.114

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$6.653

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2,077

$8.114

$6.653

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IDEA Electronic Components Group

UK . 1,167 parts In-Stock

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$8.114

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$7.303

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1,167

$8.114

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$7.303

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AZTECH Wire

Italy . 290 parts In-Stock

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$12.131

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290

$12.131

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One Stop Electronics

USA . 1,455 parts In-Stock

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$64.000

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$64.000

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Corphita

USA . 4,287 parts In-Stock

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Overview

Experience top-notch quality and reliability with the Texas Instruments SNC54251J. As a leading manufacturer in the industry, Texas Instruments delivers unparalleled performance in the Multiplexer & Demultiplexer category. With 8 inputs and 3-STATE output characteristics, this product offers exceptional value and benefits for a wide range of applications. Trust in Texas Instruments to provide cutting-edge technology that meets your needs with precision and excellence. Elevate your projects with the SNC54251J and experience the difference today.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic material provides high thermal conductivity, making it ideal for applications where heat dissipation is critical.

Screening Level: MIL-STD-883 Class B (Modified)

This high level of screening ensures reliability and performance in tough environmental conditions, making it suitable for military applications.

No. of Inputs: 8

Having 8 input channels allows for efficient multiplexing or demultiplexing of signals, increasing the versatility and functionality of the product.

Package Shape: RECTANGULAR

Rectangular shape allows for easier integration into electronic systems and saves space compared to other shapes.

No. of Terminals: 16

Having 16 terminals provides flexibility in connecting the device to other components in the circuit, enabling complex signal routing.

Package Style (Meter): IN-LINE

The in-line package style is compact and easy to mount on PCBs, reducing overall system size and simplifying assembly.

Maximum Operating Temperature: 125 °C

This high maximum operating temperature ensures the product can withstand harsh operating conditions without performance degradation.

Output Characteristics: 3-STATE

3-state output allows for high impedance state, reducing power consumption and enabling multiple devices to share a common signal line.

Minimum Operating Temperature: -55 °C

The low minimum operating temperature means the product can operate reliably in cold environments, expanding its range of use cases.

Terminal Position: DUAL

Dual terminal position provides redundancy in connection, ensuring reliable signal transmission and reducing the risk of failure.

Temperature Grade: MILITARY

Military-grade temperature range and reliability standards make this product suitable for mission-critical applications in defense and aerospace industries.

Technology: TTL

TTL technology offers fast switching speeds and low power consumption, making it suitable for high-speed data processing and communication applications.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide strong mechanical support and easy soldering, ensuring secure connections and robust performance in demanding environments.

Terminal Pitch: 2.54 mm

The 2.54 mm terminal pitch allows for easy PCB layout and compatibility with standard spacing, simplifying integration into existing electronic systems.

Technical Specifications

Multiplexer & Demultiplexer SNC54251J attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Texas Instruments

Specs

JESD-30 Code:

R-XDIP-T16

Logic IC Type:

No. of Functions:

1

No. of Inputs:

8

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Package Body Material:

CERAMIC

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Screening Level:

MIL-STD-883 Class B (Modified)

Sub-Category:

Multiplexer/Demultiplexers

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trade Compliance

SNC54251J Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-016-1280, 5962010161280

NIIN

010161280

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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