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SNC54ALS157FH

Texas Instruments

SNC54ALS157FH by Texas Instruments

SNC54ALS157FH by Texas Instruments is a TTL technology multiplexer with 4 functions, 2 inputs, and operates at temperatures ranging from -55 to 125°C. It comes in a ceramic chip carrier package with 20 terminals and is designed for military applications requiring MIL-STD-883 Class B screening.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,786 parts In-Stock

1+ parts

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5,786

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Digiode

USA . 3,999 parts In-Stock

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3,999

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 748 parts In-Stock

1+ parts

$13.559

100+ parts

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748

$13.559

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Parana Technologies

USA . 1,631 parts In-Stock

1+ parts

$25.778

100+ parts

-

1k+ parts

$26.381

10k+ parts

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1,631

$25.778

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$26.381

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ChromeModa Solutions

Germany . 6,094 parts In-Stock

1+ parts

$28.964

100+ parts

$23.750

1k+ parts

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6,094

$28.964

$23.750

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IDEA Electronic Components Group

UK . 473 parts In-Stock

1+ parts

$28.964

100+ parts

$27.516

1k+ parts

$26.068

10k+ parts

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473

$28.964

$27.516

$26.068

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One Stop Electronics

USA . 248 parts In-Stock

1+ parts

$42.000

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248

$42.000

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Corphita

USA . 2,885 parts In-Stock

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2,885

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DigiPath Technology Company

USA . 940 parts In-Stock

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$26.114

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940

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$26.114

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Overview

Enhance your electronics projects with the SNC54ALS157FH by Texas Instruments, a top-tier manufacturer renowned for quality and innovation. As a multiplexer & demultiplexer device, this product offers unparalleled performance and reliability in a variety of applications. With its MILITARY-grade temperature grade and advanced TTL technology, customers can trust in the durability and precision of this chip carrier package. Experience seamless integration and efficiency with the SNC54ALS157FH, providing value and benefits that elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic material provides excellent thermal and electrical insulation, making the product more durable and reliable in harsh operating conditions.

Surface Mount: YES

Surface mount technology allows for easy and efficient installation on printed circuit boards, saving time and space in the overall design.

No. of Functions: 4

Having 4 functions in one device reduces the need for multiple components, simplifying the circuit design and potentially reducing costs.

No. of Inputs: 2

With 2 inputs, the multiplexer/demultiplexer can handle multiple input signals efficiently, providing versatility in signal routing.

Nominal Supply Voltage / Vsup (V): 5

Operating at a nominal supply voltage of 5V makes it compatible with standard logic circuits, ensuring easy integration into existing systems.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature allows the device to withstand extreme environmental conditions, ensuring reliable operation in various applications.

Technology: TTL

Using TTL technology ensures fast switching speeds and low power consumption, making the product suitable for high-performance applications.

Technical Specifications

Multiplexer & Demultiplexer SNC54ALS157FH attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Texas Instruments

Specs

JESD-30 Code:

S-XQCC-N20

Logic IC Type:

No. of Functions:

4

No. of Inputs:

2

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC

Package Code:

Package Equivalence Code:

LCC20,.35SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Power Supplies (V):

5

Qualification:

Not Qualified

Screening Level:

MIL-STD-883 Class B (Modified)

Sub-Category:

Multiplexer/Demultiplexers

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Trade Compliance

SNC54ALS157FH Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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