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SNC54153W

Texas Instruments

SNC54153W by Texas Instruments

The Texas Instruments SNC54153W is a ceramic multiplexer with 2 functions, 4 inputs, and operates at temperatures from -55°C to 125°C. It features MIL-STD-883 Class B screening and TTL technology, suitable for military applications requiring high reliability in harsh environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,152 parts In-Stock

1+ parts

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2,152

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Digiode

USA . 527 parts In-Stock

1+ parts

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527

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,544 parts In-Stock

1+ parts

$7.815

100+ parts

-

1k+ parts

$8.366

10k+ parts

-

1,544

$7.815

-

$8.366

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DigiPath Technology Company

USA . 1,276 parts In-Stock

1+ parts

$8.605

100+ parts

$7.917

1k+ parts

-

10k+ parts

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1,276

$8.605

$7.917

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ChromeModa Solutions

Germany . 5,927 parts In-Stock

1+ parts

$8.781

100+ parts

$7.200

1k+ parts

-

10k+ parts

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5,927

$8.781

$7.200

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IDEA Electronic Components Group

UK . 2,022 parts In-Stock

1+ parts

$8.781

100+ parts

$8.342

1k+ parts

$7.903

10k+ parts

-

2,022

$8.781

$8.342

$7.903

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AZTECH Wire

Italy . 375 parts In-Stock

1+ parts

$13.367

100+ parts

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375

$13.367

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One Stop Electronics

USA . 1,394 parts In-Stock

1+ parts

$38.000

100+ parts

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1,394

$38.000

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Corphita

USA . 3,450 parts In-Stock

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3,450

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Overview

Elevate your electronic designs with the SNC54153W by Texas Instruments, a top-of-the-line multiplexer & demultiplexer that promises unmatched quality and reliability. Manufactured by industry leader Texas Instruments, this versatile component offers a wide range of applications and benefits for customers. With a MIL-STD-883 Class B screening level and military-grade temperature grade, this product ensures optimal performance in any environment. Trust in Texas Instruments to deliver cutting-edge technology and superior products like the SNC54153W, providing value and advantages that set you apart from the competition.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic material provides high thermal conductivity and excellent stability, making the product suitable for military and high-temperature applications.

Surface Mount: YES

Surface mount technology allows for easier and more efficient assembly of electronic components, saving space and reducing production costs.

No. of Functions: 2

Having multiple functions in one device reduces the need for additional components and simplifies the overall circuit design.

No. of Inputs: 4

The multiplexer/demultiplexer with 4 inputs allows versatile signal routing and selection capabilities, offering flexibility in various applications.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard 5V supply voltage ensures compatibility with a wide range of other digital components and systems.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, the product can withstand harsh environmental conditions and is suitable for rugged military applications.

Technology: TTL

TTL (Transistor-Transistor Logic) technology offers high-speed operation and compatibility with popular digital systems, ensuring reliable performance.

Technical Specifications

Multiplexer & Demultiplexer SNC54153W attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Texas Instruments

Specs

JESD-30 Code:

R-XDFP-F16

Logic IC Type:

No. of Functions:

2

No. of Inputs:

4

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC

Package Code:

DFP

Package Equivalence Code:

FL16,.3

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Qualification:

Not Qualified

Screening Level:

MIL-STD-883 Class B (Modified)

Sub-Category:

Multiplexer/Demultiplexers

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trade Compliance

SNC54153W Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-027-7624, 5962010277624

NIIN

010277624

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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