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SNC54151AJ

Texas Instruments

SNC54151AJ by Texas Instruments

SNC54151AJ by Texas Instruments is a MIL-STD-883 Class B multiplexer with 8 inputs and 16 terminals. It operates at a supply voltage of 5V, has a propagation delay of 38ns, and can withstand temperatures from -55 to 125°C. Ideal for military applications requiring high-speed signal switching in compact spaces.

Median Price

$12.939

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

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Freelance Electronics

USA . 4 parts In-Stock

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$6.958

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American Microsemiconductor Inc.

USA . 11 parts In-Stock

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$18.920

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Vyrian

USA . 5,483 parts In-Stock

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Digiode

USA . 3,218 parts In-Stock

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Classic Components Corporation

USA . 283 parts In-Stock

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Corel Iberica Componentes, S.L.

Spain . 76 parts In-Stock

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Electronic Expediters

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LWI Electronics Inc

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Parana Technologies

USA . 660 parts In-Stock

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$8.417

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$9.053

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DigiPath Technology Company

USA . 583 parts In-Stock

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$9.268

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$8.526

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ChromeModa Solutions

Germany . 5,732 parts In-Stock

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$9.457

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$7.755

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IDEA Electronic Components Group

UK . 736 parts In-Stock

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$9.457

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$8.511

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AZTECH Wire

Italy . 493 parts In-Stock

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One Stop Electronics

USA . 377 parts In-Stock

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Corphita

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Kepictronics

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Assy Fe

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Overview

Elevate your electronic projects with the Texas Instruments SNC54151AJ multiplexer and demultiplexer. Designed with precision and quality in mind, this product from a renowned manufacturer offers unparalleled performance and reliability. Perfect for military-grade applications, the SNC54151AJ features 8 inputs, a fast propagation delay of 38 ns, and a wide operating temperature range. With its compact design and ease of use, this device provides exceptional value and efficiency for all your circuit needs. Experience the advantages of cutting-edge technology with the Texas Instruments SNC54151AJ.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

Provides excellent durability and reliability for long-term use.

Screening Level: MIL-STD-883 Class B (Modified)

Ensures high quality and reliability in operation under different environmental conditions.

No. of Inputs: 8

Allows for multiple input signals to be processed simultaneously.

Nominal Supply Voltage / Vsup (V): 5

Optimal supply voltage for efficient performance.

Propagation Delay (tpd): 38 ns

Provides fast signal processing for responsive operation.

Maximum Operating Temperature: 125 °C

Allows for operation in high temperature environments.

Minimum Operating Temperature: -55 °C

Enables operation in low temperature conditions.

Technology: TTL

Utilizes industry-standard TTL technology for reliable signal processing.

Technical Specifications

Multiplexer & Demultiplexer SNC54151AJ attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Texas Instruments

Specs

Family:

TTL/H/L

JESD-30 Code:

R-CDIP-T16

Length:

19.56 mm

Logic IC Type:

No. of Functions:

1

No. of Inputs:

8

No. of Outputs:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Propagation Delay (tpd):

38 ns

Qualification:

Not Qualified

Screening Level:

MIL-STD-883 Class B (Modified)

Maximum Seated Height:

5.08 mm

Sub-Category:

Multiplexer/Demultiplexers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7.62 mm

Trade Compliance

SNC54151AJ Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-00-543-2296, 5962005432296

NIIN

005432296

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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