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SN74LS398FN3

Texas Instruments

SN74LS398FN3 by Texas Instruments

SN74LS398FN3 by Texas Instruments is a TTL multiplexer/demultiplexer with 4 functions, 2 inputs, and operates at 5V. It comes in a square chip carrier package with 20 terminals and can withstand temperatures from 0 to 70°C. Ideal for commercial applications requiring signal routing and data selection in electronic circuits.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,301 parts In-Stock

1+ parts

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5,301

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Digiode

USA . 4,328 parts In-Stock

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4,328

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 2,358 parts In-Stock

1+ parts

$9.552

100+ parts

-

1k+ parts

$10.150

10k+ parts

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2,358

$9.552

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$10.150

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DigiPath Technology Company

USA . 2,223 parts In-Stock

1+ parts

$10.518

100+ parts

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2,223

$10.518

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ChromeModa Solutions

Germany . 3,872 parts In-Stock

1+ parts

$10.733

100+ parts

$8.801

1k+ parts

-

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3,872

$10.733

$8.801

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IDEA Electronic Components Group

UK . 888 parts In-Stock

1+ parts

$10.733

100+ parts

$10.196

1k+ parts

$9.660

10k+ parts

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888

$10.733

$10.196

$9.660

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AZTECH Wire

Italy . 652 parts In-Stock

1+ parts

$12.692

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652

$12.692

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One Stop Electronics

USA . 1,606 parts In-Stock

1+ parts

$34.000

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1,606

$34.000

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Corphita

USA . 907 parts In-Stock

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907

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Overview

Unlock the potential of your electronic projects with the high-quality SN74LS398FN3 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers reliable and efficient solutions for multiplexing and demultiplexing applications. With its versatile design and easy-to-use features, this product offers incredible value and benefits to customers looking to streamline their circuit designs. Trust Texas Instruments to provide you with top-of-the-line components that will enhance the performance of your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material makes the product lightweight and durable, suitable for various applications.

Surface Mount: YES

The surface mount feature allows for easy and secure installation on circuit boards, saving space and facilitating mass production.

No. of Functions: 4

With 4 functions in one device, this multiplexer & demultiplexer offers versatility and efficiency in signal processing and routing.

No. of Inputs: 2

Having 2 inputs allows for multiple input signals to be processed and switched effectively, enhancing the product's functionality.

Nominal Supply Voltage / Vsup (V): 5

Operates at a standard 5V supply voltage, compatible with most electronic systems and ensuring reliable performance.

No. of Terminals: 20

With 20 terminals, this product offers ample connectivity options for integrating into complex electronic circuits.

Maximum Operating Temperature: 70 °C

Capable of operating at temperatures up to 70°C, making it suitable for a wide range of environments and applications.

Technology: TTL

Utilizing TTL technology ensures high-speed and reliable signal processing, ideal for demanding applications such as data communication.

Technical Specifications

Multiplexer & Demultiplexer SN74LS398FN3 attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Texas Instruments

Specs

JESD-30 Code:

S-PQCC-J20

Logic IC Type:

No. of Functions:

4

No. of Inputs:

2

No. of Terminals:

20

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC20,.4SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Sub-Category:

Multiplexer/Demultiplexers

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trade Compliance

SN74LS398FN3 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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