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PCA9544APWE4

Texas Instruments

PCA9544APWE4 by Texas Instruments

PCA9544APWE4 by Texas Instruments is a 4-input multiplexer with 1 ns propagation delay. Operating temperature ranges from -40 to 85 °C, suitable for industrial applications. It has a small outline package with dimensions of 6.5mm x 4.4mm and terminal pitch of 0.65 mm, making it ideal for compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,710 parts In-Stock

1+ parts

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5,710

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Digiode

USA . 3,321 parts In-Stock

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3,321

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Nova Conductors

Japan . 37 parts In-Stock

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37

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Distributors (Availability)

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Parana Technologies

USA . 1,317 parts In-Stock

1+ parts

$14.325

100+ parts

-

1k+ parts

$14.774

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1,317

$14.325

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$14.774

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DigiPath Technology Company

USA . 1,944 parts In-Stock

1+ parts

$15.773

100+ parts

$14.511

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-

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1,944

$15.773

$14.511

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ChromeModa Solutions

Germany . 985 parts In-Stock

1+ parts

$16.095

100+ parts

$13.198

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985

$16.095

$13.198

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IDEA Electronic Components Group

UK . 285 parts In-Stock

1+ parts

$16.095

100+ parts

$15.290

1k+ parts

$14.486

10k+ parts

-

285

$16.095

$15.290

$14.486

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AZTECH Wire

Italy . 306 parts In-Stock

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$19.226

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306

$19.226

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Corohmni

South Africa . 510 parts In-Stock

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$25.340

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510

$25.340

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One Stop Electronics

USA . 272 parts In-Stock

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$28.000

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272

$28.000

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Semicontronic

India . 907 parts In-Stock

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$39.000

100+ parts

$38.025

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$37.830

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907

$39.000

$38.025

$37.830

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Ampacity Inc.

Singapore . 647 parts In-Stock

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$62.000

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647

$62.000

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Microchip USA

USA . 7,679 parts In-Stock

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Argo Parts USA

USA . 3,394 parts In-Stock

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Continental Prestige Electronics

USA . 1,366 parts In-Stock

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Bastille Electronics

Australia . 800 parts In-Stock

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800

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Corphita

USA . 609 parts In-Stock

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609

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Perfect Parts

USA . 549 parts In-Stock

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549

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Overview

Unlock the power of seamless signal routing with the PCA9544APWE4 by Texas Instruments. Crafted with precision and reliability, this multiplexer/demultiplexer delivers unparalleled performance in a compact design. Ideal for a wide range of applications, this innovative product offers customers the flexibility and efficiency they need. Elevate your projects with the quality and value of Texas Instruments, and experience the difference for yourself.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for various applications.

Propagation Delay At Nominal Supply: 1 ns

Low propagation delay ensures fast and efficient operation of the multiplexer/demultiplexer.

Surface Mount: YES

Ease of installation and space-saving design with surface mount capability.

No. of Inputs: 4

Sufficient number of inputs for versatile connectivity options.

Nominal Supply Voltage / Vsup (V): 2.5

Works efficiently within the specified voltage range for reliable performance.

Load Capacitance (CL): 100 pF

Designed to accommodate a specific load capacitance for optimal operation.

No. of Terminals: 20

Sufficient terminals for connecting multiple components and peripherals.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Compact and space-efficient package design for easy integration into different systems.

Propagation Delay (tpd): 1000 ns

Low propagation delay ensures minimal signal delay and high-speed data transmission.

Maximum Operating Temperature: 85 °C

Can operate efficiently at high temperatures, suitable for industrial environments.

Minimum Operating Temperature: -40 °C

Can withstand low temperatures, making it suitable for a wide range of operating conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

Provides a reliable and corrosion-resistant finish for long-term performance.

Terminal Position: DUAL

Dual terminal position allows for flexibility in installation and connection options.

Width: 4.4 mm

Compact width for fitting into tight spaces and crowded PCB layouts.

Output Polarity: TRUE

Output polarity is consistent and accurate for proper signal processing.

Minimum Supply Voltage (Vsup): 2.3 V

Can operate efficiently even at lower supply voltages, increasing versatility.

Peak Reflow Temperature °C: 260

Capable of withstanding high reflow temperatures during manufacturing processes.

Temperature Grade: INDUSTRIAL

Designed to meet industrial-grade requirements for robust and reliable performance.

Terminal Form: GULL WING

Gull wing terminal form provides strong connections and easy soldering during installation.

Packing Method: TUBE

Secure and convenient packaging method for storage and transportation.

Maximum Supply Voltage (Vsup): 5.5 V

Can handle higher voltages for compatibility with various power sources.

Technical Specifications

Multiplexer & Demultiplexer PCA9544APWE4 attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Texas Instruments

Specs

Family:

9544

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

6.5 mm

Load Capacitance (CL):

100 pF

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inputs:

4

No. of Outputs:

1

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP20,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TUBE

Peak Reflow Temperature (C):

260

Propagation Delay At Nominal Supply:

1 ns

Propagation Delay (tpd):

1000 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.3 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Trade Compliance

PCA9544APWE4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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