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SN74HC157DR

Texas Instruments

SN74HC157DR by Texas Instruments

SN74HC157DR by Texas Instruments is a 4-function, 2-input multiplexer with a propagation delay of 32ns. It operates at a nominal voltage of 5V and has a load capacitance of 150pF. This CMOS technology device is ideal for industrial applications requiring true output polarity control in compact designs.

Median Price

$0.272

Lifecycle Status

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Texas Instruments

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Arrow

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DigiKey

USA . 7,696 parts In-Stock

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Mouser Electronics

USA . 3,954 parts In-Stock

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Chip1Stop

Japan . 1,931 parts In-Stock

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Verical

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DF Sales Co.

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Micros sp.j. W. Kędra i J. Lic

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Electronics Depot

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Semicontronic

India . 54,652 parts In-Stock

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Ampacity Inc.

Singapore . 54,235 parts In-Stock

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Argo Parts USA

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Continental Prestige Electronics

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Corohmni

South Africa . 276 parts In-Stock

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Parana Technologies

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DigiPath Technology Company

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IDEA Electronic Components Group

UK . 1,761 parts In-Stock

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ChromeModa Solutions

Germany . 318 parts In-Stock

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Computer Components Inc. - USA

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ChipTracer

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Glotronic Ltd.

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Overview

Discover the superior quality and reliability of the SN74HC157DR multiplexer by Texas Instruments. This innovative product offers unmatched performance in a variety of applications, making it a must-have for any project. With Texas Instruments' reputation for excellence in manufacturing, you can trust that this multiplexer will deliver exceptional results every time. Don't settle for anything less than the best - choose the SN74HC157DR for all your multiplexing needs and experience the value and benefits it brings to your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the product, ensuring a longer lifespan and reliable performance.

Propagation Delay At Nominal Supply: 32 ns

The fast propagation delay allows for quick signal processing, making this multiplexer/demultiplexer suitable for high-speed applications.

Surface Mount: YES

The surface mount feature makes installation and integration of this product easy and convenient in a variety of electronic devices.

No. of Functions: 4

With 4 functions available, this multiplexer/demultiplexer offers versatility in signal routing and management, making it a versatile choice for different applications.

Nominal Supply Voltage / Vsup (V): 5

The 5V nominal supply voltage ensures compatibility with common power sources, making this product easy to integrate into existing electronic systems.

Technical Specifications

Multiplexer & Demultiplexer SN74HC157DR attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Texas Instruments

Specs

Family:

HC/UH

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

9.9 mm

Load Capacitance (CL):

150 pF

Logic IC Type:

Maximum I (ol):

7.8 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

2

No. of Functions:

4

No. of Inputs:

2

No. of Outputs:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Maximum Power Supply Current (ICC):

.08 mA

Propagation Delay At Nominal Supply:

32 ns

Propagation Delay (tpd):

235 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Multiplexer/Demultiplexers

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3.9 mm

Trade Compliance

SN74HC157DR Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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