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74LVC257ADB,118

NXP Semiconductors

74LVC257ADB,118 by NXP Semiconductors

NXP Semiconductors' 74LVC257ADB,118 is a CMOS multiplexer with 4 functions and 2 inputs. It operates at a supply voltage of 2.7V to 3.6V, featuring a propagation delay of 6ns and output characteristics in the form of TRUE polarity. With a small outline package style, it is ideal for automotive applications requiring high-speed signal switching.

Median Price

$0.364

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

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Arrow

USA . 509 parts In-Stock

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$0.153

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$0.153

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DigiKey

USA . 1,602 parts In-Stock

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$0.490

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$0.314

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$0.190

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Rochester

USA . 34,032 parts In-Stock

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$0.364

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$0.302

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$0.269

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$0.364

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Verical

USA . 34,032 parts In-Stock

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$0.378

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$0.337

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Chip1Stop

Japan . 65 parts In-Stock

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Digiode

USA . 4,014 parts In-Stock

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$0.145

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Chip Stock

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VNN

France . 3,500 parts In-Stock

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Anansix

USA . 2,665 parts In-Stock

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Vyrian

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Nova Conductors

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Ampacity Inc.

Singapore . 8,606 parts In-Stock

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$0.108

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Corphita

USA . 419 parts In-Stock

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AZTECH Wire

Italy . 4,333 parts In-Stock

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Aztec Data Supply Inc.

USA . 2,763 parts In-Stock

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$9.394

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Advanced Electronics

New Zealand . 1,000 parts In-Stock

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$13.775

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$13.637

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$13.086

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$13.775

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Corohmni

South Africa . 66 parts In-Stock

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Perfect Parts

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UNI Independent Distributors

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QUARKTWIN TECHNOLOGY LTD

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Continental Prestige Electronics

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Authorized Procurement Solutions

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Argo Parts USA

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Supply Digital

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Lucentia Tech

USA . 950 parts In-Stock

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Microchip USA

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Overview

Unlock the power of seamless data transmission with the NXP Semiconductors 74LVC257ADB,118 Multiplexer & Demultiplexer. Designed with precision and quality by a trusted manufacturer, this versatile component offers 4 functions in one package, making it ideal for a wide range of applications. With a fast propagation delay and 3-state output characteristics, this product ensures efficient performance and reliability. Experience the benefits of superior technology and innovation with the 74LVC257ADB,118 - the perfect solution for your electronic projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Makes the product lightweight and durable, ideal for various applications.

Propagation Delay At Nominal Supply: 6 ns

Fast propagation delay ensures efficient data processing.

Surface Mount: YES

Easy to install on circuit boards, saving time and effort during assembly.

No. of Functions: 4

Can handle multiple functions simultaneously, increasing versatility.

No. of Inputs: 2

Suitable for applications requiring input from multiple sources.

Nominal Supply Voltage / Vsup (V): 2.7

Operates efficiently at a common supply voltage, suitable for various systems.

Load Capacitance (CL): 50 pF

Optimal load capacitance for stable performance in different circuit setups.

Power Supplies (V): 3.3

Compatible with standard power supplies, making integration easier.

No. of Terminals: 16

Sufficient terminals for connecting to other components and circuitry.

Output Characteristics: 3-STATE

Allows for high impedance state, providing flexibility in signal routing.

Minimum Operating Temperature: -40 °C

Wide temperature range ensures functionality in various environments.

Maximum Operating Temperature: 125 °C

Can withstand high temperatures, suitable for industrial and automotive applications.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high-speed operation.

Technical Specifications

Multiplexer & Demultiplexer 74LVC257ADB,118 attributes and parameters. Explore more Multiplexer & Demultiplexer devices from NXP Semiconductors

Specs

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

6.2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

4

No. of Inputs:

2

No. of Outputs:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP16,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

6 ns

Propagation Delay (tpd):

7 ns

Qualification:

Not Qualified

Maximum Seated Height:

2 mm

Sub-Category:

Multiplexer/Demultiplexers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

1.2 V

Nominal Supply Voltage / Vsup (V):

2.7

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5.3 mm

Trade Compliance

74LVC257ADB,118 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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