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74LVC157APW,118

NXP Semiconductors

74LVC157APW,118 by NXP Semiconductors

NXP Semiconductors' 74LVC157APW,118 is a CMOS multiplexer with 4 functions and 2 inputs. It operates at a nominal voltage of 2.7V to 3.3V, offering a propagation delay of 6.5ns to 7.5ns. This small-outline device is ideal for automotive applications due to its wide temperature range and low power consumption.

Median Price

$0.216

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Chip1Stop

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Mouser Electronics

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Newark

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Rochester

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Verical

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TTI

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Arrow

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Farnell

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Element14

Singapore . 683 parts In-Stock

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Digiode

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Nova Conductors

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Martec Srl

Italy . 407,500 parts In-Stock

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Chip Stock

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Bristol Electronics

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NAC Semi

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Vyrian

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IBS Electronics

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Anansix

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Semicontronic

India . 277,807 parts In-Stock

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Ampacity Inc.

Singapore . 261,432 parts In-Stock

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Corphita

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AZTECH Wire

Italy . 8,681 parts In-Stock

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Argo Parts USA

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Microchip USA

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Aztec Data Supply Inc.

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Corohmni

South Africa . 80 parts In-Stock

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Eastek

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GreenTree Electronics

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Netroflash

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Continental Prestige Electronics

USA . 1,682 parts In-Stock

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Supply Digital

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Cyclops Electronics Ltd (Excess)

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Overview

Discover the unmatched quality and reliability of the NXP Semiconductors 74LVC157APW,118 multiplexer/demultiplexer. This versatile component offers seamless integration and exceptional performance in a wide range of applications. With its innovative design and superior manufacturing standards, this product delivers outstanding value and efficiency to customers. Upgrade your electronics projects with the best in class technology from NXP Semiconductors.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this product lightweight and durable, ideal for various applications.

Propagation Delay At Nominal Supply: 6.5 ns

With a low propagation delay, this multiplexer/demultiplexer ensures quick and efficient data transmission.

Surface Mount: YES

The surface mount feature allows for easy and secure installation on PCBs, saving space and simplifying assembly processes.

No. of Functions: 4

This product offers versatility with 4 functions in one, making it a cost-effective solution for multiple signal routing needs.

No. of Inputs: 2

With 2 input channels, this multiplexer/demultiplexer can handle data from multiple sources efficiently.

Package Shape: RECTANGULAR

The rectangular package shape provides a compact and organized design, suitable for tight spaces on electronic boards.

Nominal Supply Voltage / Vsup: 2.7V

Operating at a low nominal supply voltage, this product offers energy efficiency and compatibility with various systems.

Load Capacitance (CL): 50 pF

The low load capacitance ensures minimal signal distortion and reliable performance in high-speed data applications.

Power Supplies (V): 3.3

Designed to work with a standard power supply voltage of 3.3V, this multiplexer/demultiplexer can easily integrate into existing setups.

No. of Terminals: 16

With 16 terminals, this product offers connectivity options for versatile circuit configurations.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline, thin profile, and shrink pitch package style enhance the product's portability and ease of integration into compact devices.

Maximum I (ol): 24 Amp

The high maximum output current capacity of 24 Amp ensures robust signal transmission capabilities, suitable for demanding applications.

Propagation Delay (tpd): 7.5 ns

The low propagation delay of 7.5 ns ensures minimal signal delay, crucial for time-sensitive data transmission.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this product can withstand harsh environmental conditions, making it suitable for industrial and automotive applications.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows this multiplexer/demultiplexer to function reliably in cold environments.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The terminal finish of nickel/palladium/gold provides excellent conductivity and corrosion resistance for long-lasting performance.

Terminal Position: DUAL

The dual terminal position offers flexibility in connection options, allowing for versatile circuit designs.

Maximum Seated Height: 1.1 mm

The low maximum seated height ensures a compact overall design, perfect for space-constrained applications.

Width: 4.4 mm

The narrow width of 4.4 mm allows for efficient space utilization on PCBs.

Output Polarity: TRUE

The true output polarity ensures accurate signal transmission, preventing data errors and ensuring reliable operation.

Minimum Supply Voltage (Vsup): 1.2V

With a low minimum supply voltage requirement, this product is energy-efficient and compatible with low-power systems.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time at peak reflow temperature of 30 seconds ensures safe and efficient soldering during assembly processes.

Peak Reflow Temperature °C: 260

With a peak reflow temperature of 260°C, this product can withstand high-temperature soldering processes without damage.

Length: 5 mm

The compact length of 5 mm contributes to the overall space-saving design of this multiplexer/demultiplexer.

Temperature Grade: AUTOMOTIVE

Designed for automotive applications, this product meets stringent temperature and reliability requirements for vehicle electronics.

Technology: CMOS

The CMOS technology used in this product offers low power consumption and high noise immunity for reliable performance in digital circuits.

Terminal Form: GULL WING

The gull wing terminal form provides secure solder connections and ease of assembly on PCBs.

Packing Method: TR

The TR packing method ensures safe transportation and storage of this product, protecting it from damage.

Terminal Pitch: 0.65 mm

The terminal pitch of 0.65 mm allows for precise and compact terminal connections on PCBs.

Maximum Supply Voltage (Vsup): 3.6V

With a high maximum supply voltage tolerance of 3.6V, this multiplexer/demultiplexer can accommodate a wide range of power supply specifications.

Technical Specifications

Multiplexer & Demultiplexer 74LVC157APW,118 attributes and parameters. Explore more Multiplexer & Demultiplexer devices from NXP Semiconductors

Specs

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

4

No. of Inputs:

2

No. of Outputs:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

6.5 ns

Propagation Delay (tpd):

7.5 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Multiplexer/Demultiplexers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

1.2 V

Nominal Supply Voltage / Vsup (V):

2.7

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Trade Compliance

74LVC157APW,118 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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