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SN74HC158FN3

Texas Instruments

SN74HC158FN3 by Texas Instruments

SN74HC158FN3 by Texas Instruments is a CMOS multiplexer with 4 functions and 2 inputs. It operates b/w -40°C to 85°C, suitable for industrial applications. This chip carrier package has 20 terminals, making it ideal for surface mount assembly.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,355 parts In-Stock

1+ parts

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4,355

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Digiode

USA . 1,499 parts In-Stock

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1,499

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 805 parts In-Stock

1+ parts

$8.738

100+ parts

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805

$8.738

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Parana Technologies

USA . 520 parts In-Stock

1+ parts

$8.946

100+ parts

-

1k+ parts

$9.616

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520

$8.946

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$9.616

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DigiPath Technology Company

USA . 2,127 parts In-Stock

1+ parts

$9.851

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2,127

$9.851

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IDEA Electronic Components Group

UK . 1,860 parts In-Stock

1+ parts

$10.052

100+ parts

$9.549

1k+ parts

$9.047

10k+ parts

-

1,860

$10.052

$9.549

$9.047

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ChromeModa Solutions

Germany . 192 parts In-Stock

1+ parts

$10.052

100+ parts

$8.243

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192

$10.052

$8.243

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One Stop Electronics

USA . 1,432 parts In-Stock

1+ parts

$46.000

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1,432

$46.000

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Corphita

USA . 1,419 parts In-Stock

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1,419

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Overview

Enhance your electronic designs with the high-quality SN74HC158FN3 by Texas Instruments, a leading manufacturer known for its innovative solutions. This multiplexer & demultiplexer offers unmatched performance and reliability, making it ideal for a wide range of applications. With 4 functions and 2 inputs, this product provides exceptional value and versatility to customers looking to streamline their projects. Trust Texas Instruments to deliver cutting-edge technology that exceeds expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and can withstand various environmental conditions, making the product reliable for different applications.

Surface Mount: YES

Allows for easy installation on PCBs, saving space and improving efficiency in circuit design.

No. of Functions: 4

Provides flexibility in signal routing and processing, allowing for multiple functions to be performed within a single component.

No. of Inputs: 2

Suitable for applications requiring multiple input signals to be processed or routed efficiently.

Package Shape: SQUARE

Ideal for efficient use of space on the PCB and simplifies the layout of the circuit.

Power Supplies (V): 2/6

Supports a wide range of power supply voltages, making it versatile for different system requirements.

No. of Terminals: 20

Provides ample connectivity options for interfacing with other components in the circuit.

Package Style (Meter): CHIP CARRIER

Offers a compact and reliable package style for integrated circuits, ensuring easy handling and installation.

Maximum Operating Temperature: 85 °C

Can operate effectively in high-temperature environments without performance degradation.

Minimum Operating Temperature: -40 °C

Able to withstand low-temperature conditions, making it suitable for a wide range of applications.

Terminal Position: QUAD

Facilitates easy connection and layout on the PCB for efficient signal routing.

Temperature Grade: INDUSTRIAL

Designed to withstand harsh industrial environments, ensuring reliable performance in demanding conditions.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high noise immunity, making it ideal for digital signal processing applications.

Terminal Form: J BEND

Provides a reliable connection with the PCB, ensuring secure and stable electrical contact.

Terminal Pitch: 1.27 mm

Allows for convenient and standardized connections on the PCB, ensuring compatibility with other components.

Technical Specifications

Multiplexer & Demultiplexer SN74HC158FN3 attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Texas Instruments

Specs

JESD-30 Code:

S-PQCC-J20

Logic IC Type:

No. of Functions:

4

No. of Inputs:

2

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC20,.4SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Power Supplies (V):

2/6

Sub-Category:

Multiplexer/Demultiplexers

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Trade Compliance

SN74HC158FN3 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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