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SN74CB3Q3257DGVR

Texas Instruments

SN74CB3Q3257DGVR by Texas Instruments

SN74CB3Q3257DGVR by Texas Instruments is a 4-function multiplexer with 0.12 ns propagation delay at 2.5V, suitable for industrial applications. It features a small outline package with dimensions of 4.4mm x 3.6mm and operates within a temperature range of -40 to 85°C.

Median Price

$0.600

Lifecycle Status

Suppliers In-Stock

18

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 4,627 parts In-Stock

1+ parts

$0.712

100+ parts

$0.484

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$0.248

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4,627

$0.712

$0.484

$0.248

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Mouser Electronics

USA . 1,738 parts In-Stock

1+ parts

$0.860

100+ parts

$0.489

1k+ parts

$0.435

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$0.380

1,738

$0.860

$0.489

$0.435

$0.380

Rochester

USA . 90,493 parts In-Stock

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-

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$0.482

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$0.400

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$0.357

90,493

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$0.482

$0.400

$0.357

DigiKey

USA . 90,493 parts In-Stock

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$0.600

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Verical

USA . 57,870 parts In-Stock

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$0.500

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$0.446

57,870

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$0.500

$0.446

Distributors (In-Stock)

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DF Sales Co.

USA . 665 parts In-Stock

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$0.200

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665

$0.200

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DF Sales Co.

USA . 665 parts In-Stock

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$0.200

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665

$0.200

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Digiode

USA . 4,959 parts In-Stock

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$0.327

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4,959

$0.327

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Nova Conductors

Japan . 100 parts In-Stock

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$0.600

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100

$0.600

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DigiKey Marketplace

USA . 115,993 parts In-Stock

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$0.450

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$0.450

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Vyrian

USA . 55,525 parts In-Stock

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55,525

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Chip Stock

USA . 10,700 parts In-Stock

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Sensible Micro Corp

USA . 1,128 parts In-Stock

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R&J Components

USA . 1,000 parts In-Stock

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1,000

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Elcom Components

USA . 105 parts In-Stock

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105

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Prism Electronics

USA . 61 parts In-Stock

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Bristol Electronics

USA . 12 parts In-Stock

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Flex Direct, LLC

USA . 12 parts In-Stock

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Distributors (Availability)

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Corphita

USA . 2,051 parts In-Stock

1+ parts

$0.310

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2,051

$0.310

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Argo Parts USA

USA . 3,784 parts In-Stock

1+ parts

$0.492

100+ parts

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$0.477

3,784

$0.492

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$0.477

Continental Prestige Electronics

USA . 772 parts In-Stock

1+ parts

$0.492

100+ parts

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$0.482

772

$0.492

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$0.482

Netroflash

USA . 2,000 parts In-Stock

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$0.600

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$0.600

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Ampacity Inc.

Singapore . 55,576 parts In-Stock

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$0.640

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Microchip USA

USA . 8,413 parts In-Stock

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$2.896

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Parana Technologies

USA . 1,393 parts In-Stock

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$21.221

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$21.520

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$21.221

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ChromeModa Solutions

Germany . 2,367 parts In-Stock

1+ parts

$23.844

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$19.552

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2,367

$23.844

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IDEA Electronic Components Group

UK . 1,251 parts In-Stock

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$23.844

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$22.652

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$21.460

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$21.460

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Corohmni

South Africa . 713 parts In-Stock

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$25.702

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713

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GreenTree Electronics

Israel . 10,000 parts In-Stock

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Perfect Parts

USA . 7,725 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,597 parts In-Stock

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DigiPath Technology Company

USA . 2,176 parts In-Stock

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$21.498

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Kepictronics

USA . 172 parts In-Stock

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Overview

Enhance your electronic projects with the SN74CB3Q3257DGVR by Texas Instruments, a top-of-the-line multiplexer & demultiplexer that guarantees unmatched quality and reliability. Manufactured by industry leader Texas Instruments, this versatile component offers 4 functions in a compact, surface-mount package, making it ideal for a wide range of applications. With a low propagation delay and 3-state output characteristics, this product ensures efficient operation and seamless performance in industrial settings. Trust Texas Instruments to deliver cutting-edge technology that exceeds expectations and unlocks endless possibilities for your projects. Choose the SN74CB3Q3257DGVR for unparalleled value and unrivaled performance.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and provides protection for the internal components of the multiplexer/demultiplexer.

Propagation Delay At Nominal Supply: 0.12 ns

Low propagation delay ensures fast and efficient signal processing.

Surface Mount: YES

Surface mount capability allows for easy integration onto circuit boards, saving space and simplifying assembly.

Nominal Supply Voltage / Vsup (V): 2.5

Operating at a low supply voltage of 2.5V can help reduce power consumption and heat generation.

Maximum Operating Temperature: 85 °C

Wide operating temperature range makes the multiplexer/demultiplexer suitable for industrial applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product reliable and energy-efficient.

Technical Specifications

Multiplexer & Demultiplexer SN74CB3Q3257DGVR attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Texas Instruments

Specs

Family:

CB3Q/3VH/3C/2B

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

4.4 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

4

No. of Inputs:

1

No. of Outputs:

2

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP16,.25,16

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/3.3

Maximum Power Supply Current (ICC):

.7 mA

Propagation Delay At Nominal Supply:

.12 ns

Propagation Delay (tpd):

.2 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Other Logic ICs

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.3 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.6 mm

Trade Compliance

SN74CB3Q3257DGVR Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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