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MC10EL57DG

Onsemi

MC10EL57DG by Onsemi

MULTIPLEXER; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR;

Median Price

$5.220

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 44 parts In-Stock

1+ parts

$5.324

100+ parts

$2.007

1k+ parts

$1.957

10k+ parts

$1.907

44

$5.324

$2.007

$1.957

$1.907

Verical

USA . 44 parts In-Stock

1+ parts

-

100+ parts

$2.007

1k+ parts

$1.957

10k+ parts

$1.907

44

-

$2.007

$1.957

$1.907

Rochester

USA . 9 parts In-Stock

1+ parts

-

100+ parts

$5.220

1k+ parts

$4.670

10k+ parts

$4.390

9

-

$5.220

$4.670

$4.390

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,406 parts In-Stock

1+ parts

$5.510

100+ parts

-

1k+ parts

-

10k+ parts

-

1,406

$5.510

-

-

-

Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$7.195

100+ parts

-

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-

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-

10

$7.195

-

-

-

Flip Electronics

USA . 4,128 parts In-Stock

1+ parts

-

100+ parts

-

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-

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4,128

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-

-

-

Chip Stock

USA . 3,798 parts In-Stock

1+ parts

-

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-

1k+ parts

-

10k+ parts

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3,798

-

-

-

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Vyrian

USA . 3,539 parts In-Stock

1+ parts

-

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-

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3,539

-

-

-

-

Sensible Micro Corp

USA . 2,446 parts In-Stock

1+ parts

-

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2,446

-

-

-

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ComSIT Distribution GmbH

Germany . 47 parts In-Stock

1+ parts

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47

-

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Elcom Components

USA . 10 parts In-Stock

1+ parts

-

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10

-

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 32 parts In-Stock

1+ parts

$4.930

100+ parts

-

1k+ parts

-

10k+ parts

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32

$4.930

-

-

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Corphita

USA . 1,149 parts In-Stock

1+ parts

$5.220

100+ parts

-

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10k+ parts

-

1,149

$5.220

-

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Corohmni

South Africa . 176 parts In-Stock

1+ parts

$5.800

100+ parts

-

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-

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176

$5.800

-

-

-

Component Stockers USA

USA . 8 parts In-Stock

1+ parts

$5.920

100+ parts

-

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-

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-

8

$5.920

-

-

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Aranea Global

USA . 1,000 parts In-Stock

1+ parts

$7.051

100+ parts

-

1k+ parts

$6.769

10k+ parts

-

1,000

$7.051

-

$6.769

-

Continental Prestige Electronics

USA . 2,229 parts In-Stock

1+ parts

$7.125

100+ parts

-

1k+ parts

-

10k+ parts

$6.982

2,229

$7.125

-

-

$6.982

AZTECH Wire

Italy . 192 parts In-Stock

1+ parts

$16.936

100+ parts

-

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10k+ parts

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192

$16.936

-

-

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Microchip USA

USA . 2,167 parts In-Stock

1+ parts

$29.510

100+ parts

$29.090

1k+ parts

$28.880

10k+ parts

$28.670

2,167

$29.510

$29.090

$28.880

$28.670

TANS Electronics

Latvia . 7,109 parts In-Stock

1+ parts

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7,109

-

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Problanco Electronics

Mexico . 6,081 parts In-Stock

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6,081

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Kulean Microsystems

USA . 5,372 parts In-Stock

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5,372

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SupplyDigital Components

Austria . 3,378 parts In-Stock

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3,378

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Perfect Parts

USA . 514 parts In-Stock

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514

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UHIMA Technologies

Türkiye . 355 parts In-Stock

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355

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Argo Parts USA

USA . 351 parts In-Stock

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351

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Technical Specifications

Multiplexer & Demultiplexer MC10EL57DG attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Onsemi

Specs

Additional Features:

NECL MODE OPERATING RANGE: VEE = -4.2 V TO -5.7 V WITH VCC = 0 V

Family:

10EL

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e3

Length:

9.9 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inputs:

4

No. of Outputs:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

OPEN-EMITTER

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

RAIL

Peak Reflow Temperature (C):

260

Power Supplies (V):

-5.2

Maximum Power Supply Current (ICC):

24 mA

Propagation Delay At Nominal Supply:

.58 ns

Propagation Delay (tpd):

.56 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Multiplexer/Demultiplexers

Maximum Supply Voltage (Vsup):

5.7 V

Minimum Supply Voltage (Vsup):

4.2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

MC10EL57DG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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