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74LVC1G157GS,132

NXP Semiconductors

74LVC1G157GS,132 by NXP Semiconductors

NXP Semiconductors' 74LVC1G157GS,132 is a CMOS multiplexer with 2 inputs, 6.3 ns propagation delay, and 50 pF load capacitance. Ideal for automotive applications due to its small outline package and wide operating temperature range of -40 to 125°C. Suitable for surface mount assembly with a max supply voltage of 5.5V.

Median Price

$0.206

Lifecycle Status

Suppliers In-Stock

16

In-Stock Inventory

1k+

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Mouser Electronics

USA . 6,842 parts In-Stock

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$0.250

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$0.121

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$0.109

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$0.096

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$0.250

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$0.096

DigiKey

USA . 3,924 parts In-Stock

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$0.250

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$0.131

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$0.109

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$0.088

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$0.088

Farnell

UK . 114,219 parts In-Stock

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Rochester

USA . 93,031 parts In-Stock

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Verical

USA . 50,219 parts In-Stock

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Avnet

USA . 5,000 parts In-Stock

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$0.198

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Arrow

USA . 5,000 parts In-Stock

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$0.087

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EBV Elektronik

Germany . 5,000 parts In-Stock

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Chip1Stop

Japan . 5,000 parts In-Stock

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Digiode

USA . 1,010 parts In-Stock

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$0.083

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Nova Conductors

Japan . 19 parts In-Stock

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Chip Stock

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NAC Semi

USA . 10,000 parts In-Stock

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Vyrian

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Anansix

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VNN

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Ampacity Inc.

Singapore . 37,035 parts In-Stock

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Corphita

USA . 763 parts In-Stock

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Argo Parts USA

USA . 3,385 parts In-Stock

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$0.089

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Netroflash

USA . 1,000 parts In-Stock

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AZTECH Wire

Italy . 7,109 parts In-Stock

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Microchip USA

USA . 3,064 parts In-Stock

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Corohmni

South Africa . 640 parts In-Stock

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Aztec Data Supply Inc.

USA . 3,973 parts In-Stock

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Continental Prestige Electronics

USA . 110,377 parts In-Stock

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Eastek

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UNI Independent Distributors

Spain . 4,625 parts In-Stock

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Supply Digital

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Overview

Unlock the power of advanced technology with the NXP Semiconductors 74LVC1G157GS,132. Designed for precision and reliability, this multiplexer/demultiplexer boasts a compact design and fast propagation delay, making it ideal for automotive applications. With a wide range of operating temperatures and a low supply voltage, this product offers exceptional value and performance, giving customers the edge they need in today's competitive market. Trust NXP Semiconductors to deliver quality and innovation for all your electronic needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring a longer lifespan for the product.

Propagation Delay At Nominal Supply: 6.3 ns

Low propagation delay ensures fast and efficient signal transmission, making this product suitable for high-speed data processing.

Surface Mount: YES

Allows for easy installation and integration onto circuit boards, saving time and effort during assembly.

No. of Inputs: 2

Provides flexibility in signal routing and allows for multiple input sources to be processed efficiently.

Nominal Supply Voltage / Vsup (V): 1.8

Low supply voltage requirements help in reducing power consumption and heat dissipation, making this product energy-efficient.

Load Capacitance (CL): 50 pF

Suitable for handling a variety of capacitance loads, ensuring compatibility with different applications.

Power Supplies (V): 3.3

Compatible with standard power supply voltages, making it easy to integrate into existing systems.

Package Style (Meter): SMALL OUTLINE, VERY THIN PROFILE

Space-saving design allows for efficient use of PCB real estate, especially in compact electronic devices.

Maximum I (ol): 24 Amp

High output current capability allows for driving heavy loads, making this product suitable for demanding applications.

Maximum Operating Temperature: 125 °C

Can operate effectively in a wide range of temperature conditions, making it suitable for various environments.

Minimum Operating Temperature: -40 °C

Capable of functioning in low-temperature conditions, ensuring reliability in harsh environments.

Terminal Finish: TIN

Provides corrosion resistance and enhances the longevity of the terminals, ensuring a stable connection over time.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making this product energy-efficient and reliable.

Technical Specifications

Multiplexer & Demultiplexer 74LVC1G157GS,132 attributes and parameters. Explore more Multiplexer & Demultiplexer devices from NXP Semiconductors

Specs

Family:

LVC/LCX/Z

JESD-30 Code:

S-PDSO-N6

JESD-609 Code:

e3

Length:

1 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inputs:

2

No. of Outputs:

1

No. of Terminals:

6

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC6,.04,14

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

6.3 ns

Propagation Delay (tpd):

13 ns

Qualification:

Not Qualified

Maximum Seated Height:

.35 mm

Sub-Category:

Multiplexer/Demultiplexers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.35 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1 mm

Trade Compliance

74LVC1G157GS,132 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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