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CD74HCT356M96E4

Texas Instruments

CD74HCT356M96E4 by Texas Instruments

CD74HCT356M96E4 by Texas Instruments is an 8-input multiplexer with a propagation delay of 77ns at 5V. It features a small outline package, operates b/w -55 to 125°C, and has a max supply voltage of 5.5V. Ideal for military-grade applications requiring high-speed signal switching in compact spaces.

Median Price

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Lifecycle Status

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2

In-Stock Inventory

1k+

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Vyrian

USA . 5,935 parts In-Stock

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Digiode

USA . 4,799 parts In-Stock

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Native Components

USA . 257 parts In-Stock

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$0.438

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$0.420

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Northwest PG Solutions

USA . 2,154 parts In-Stock

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$0.482

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$0.425

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Parana Technologies

USA . 1,366 parts In-Stock

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$11.226

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$1,042.547

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$10.104

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DigiPath Technology Company

USA . 1,349 parts In-Stock

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$12.362

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ChromeModa Solutions

Germany . 5,535 parts In-Stock

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$12.614

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$10.343

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IDEA Electronic Components Group

UK . 2,023 parts In-Stock

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$11.983

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$11.353

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AZTECH Wire

Italy . 452 parts In-Stock

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$13.418

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One Stop Electronics

USA . 1,174 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 24,749 parts In-Stock

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Microchip USA

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Corphita

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Overview

Experience the unparalleled quality and reliability of Texas Instruments with the CD74HCT356M96E4 multiplexer. This innovative product offers a wide range of applications in the field of electronics, providing customers with efficient and precise data processing. With a compact design and advanced technology, this multiplexer guarantees fast propagation delay and low power consumption, ensuring superior performance in any project. Trust Texas Instruments for top-notch products that deliver exceptional value and unmatched benefits to meet all your technical needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and reliability in various operating conditions.

Propagation Delay At Nominal Supply: 77 ns

The low propagation delay ensures fast switching and high-speed performance of the multiplexer/demultiplexer.

Surface Mount: YES

Surface mount capability allows for easy and convenient installation on PCBs, saving space and reducing assembly time.

No. of Inputs: 8

With 8 inputs, this multiplexer/demultiplexer can handle multiple input signals efficiently.

Nominal Supply Voltage / Vsup (V): 5

The 5V supply voltage is a common standard in many electronic systems, making integration easier.

Load Capacitance (CL): 50 pF

The load capacitance of 50 pF ensures stable and reliable operation of the device with external components.

Power Supplies (V): 5

The compatibility with a 5V power supply simplifies the power management and reduces the need for additional voltage regulation.

No. of Terminals: 20

The 20 terminals provide ample connectivity options for interfacing with other components in the system.

Package Style (Meter): SMALL OUTLINE

The small outline package design saves space on the PCB and allows for denser board layouts.

Maximum I (ol): 4 Amp

The high output current capability of 4A enables the driving of high-current loads with ease.

Output Characteristics: 3-STATE

The 3-STATE output allows for high impedance state, reducing power consumption and enabling bus sharing in the system.

Minimum Operating Temperature: -55 °C

The wide operating temperature range of -55 to 125°C ensures reliable operation in extreme environmental conditions.

Technology: CMOS

The CMOS technology offers low power consumption, high noise immunity, and compatibility with a wide range of digital systems.

Maximum Supply Voltage (Vsup): 5.5 V

The maximum supply voltage of 5.5V provides some margin for voltage fluctuations, enhancing the device's robustness.

Technical Specifications

Multiplexer & Demultiplexer CD74HCT356M96E4 attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Texas Instruments

Specs

Additional Features:

TRANSPARENT ADDRESS LATCHES; REGISTERED DATA INPUTS

Family:

HCT

JESD-30 Code:

R-PDSO-G20

Length:

12.8 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

4 Amp

No. of Functions:

1

No. of Inputs:

8

No. of Outputs:

1

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Propagation Delay At Nominal Supply:

77 ns

Propagation Delay (tpd):

77 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Multiplexer/Demultiplexers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7.5 mm

Trade Compliance

CD74HCT356M96E4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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