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74ACT11251J

Texas Instruments

74ACT11251J by Texas Instruments

74ACT11251J by Texas Instruments is an 8-input CMOS multiplexer with a supply voltage of 5V. It operates in industrial temperature range (-40 to 85°C) and features 3-STATE output characteristics. This rectangular ceramic package with 16 terminals is ideal for applications requiring high-speed signal switching.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 8,436 parts In-Stock

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Digiode

USA . 374 parts In-Stock

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One Stop Electronics

USA . 1,363 parts In-Stock

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$8.000

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$8.000

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Parana Technologies

USA . 574 parts In-Stock

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$8.556

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$794.514

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$7.700

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574

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DigiPath Technology Company

USA . 902 parts In-Stock

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$9.421

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$8.667

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902

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ChromeModa Solutions

Germany . 4,835 parts In-Stock

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$9.613

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$7.883

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IDEA Electronic Components Group

UK . 1,605 parts In-Stock

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$9.613

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$9.132

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$8.652

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AZTECH Wire

Italy . 207 parts In-Stock

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$11.395

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Native Components

USA . 244 parts In-Stock

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$14.080

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Northwest PG Solutions

USA . 1,272 parts In-Stock

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$15.488

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$13.939

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Corphita

USA . 2,313 parts In-Stock

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Overview

Upgrade your electronic projects with the 74ACT11251J from Texas Instruments, a leading manufacturer known for top-quality components. This versatile multiplexer & demultiplexer offers a seamless integration of up to 8 inputs in a compact ceramic package, ensuring reliable performance in industrial-grade applications. With a nominal supply voltage of 5V and 3-STATE output characteristics, this product provides unmatched value and efficiency for your designs. Trust Texas Instruments to deliver superior quality and innovation for your next project.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic is known for its excellent heat resistance and durability, making it ideal for industrial applications where the operating temperature can vary.

No. of Inputs: 8

With 8 inputs, this multiplexer/demultiplexer can handle a wide range of signals or data streams simultaneously, providing versatility and flexibility in signal routing.

Nominal Supply Voltage / Vsup (V): 5

A 5V nominal supply voltage is common in many electronic systems, making this multiplexer/demultiplexer compatible with a wide range of applications.

No. of Terminals: 16

With 16 terminals, this device can easily connect to various other components or circuits, allowing for efficient signal routing and processing.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, this multiplexer/demultiplexer can withstand high temperatures, making it suitable for industrial environments where heat may be a concern.

Output Characteristics: 3-STATE

The 3-STATE output characteristics allow for high impedance states, which can help prevent signal interference or crosstalk in complex electronic systems.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making this multiplexer/demultiplexer efficient and reliable in various applications.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide strong mechanical connections, making this device more durable and reliable in harsh operating conditions.

Technical Specifications

Multiplexer & Demultiplexer 74ACT11251J attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Texas Instruments

Specs

JESD-30 Code:

R-XDIP-T16

Logic IC Type:

No. of Functions:

1

No. of Inputs:

8

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Package Body Material:

CERAMIC

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

5

Qualification:

Not Qualified

Sub-Category:

Multiplexer/Demultiplexers

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

74ACT11251J Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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