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SN74CB3Q3251PWG4

Texas Instruments

SN74CB3Q3251PWG4 by Texas Instruments

SN74CB3Q3251PWG4 by Texas Instruments is a 16-terminal CMOS multiplexer with a propagation delay of 0.18 ns. It operates at a nominal voltage of 2.5V and has 8 outputs with 3-STATE output characteristics. Ideal for industrial applications requiring fast switching and low power consumption.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,675 parts In-Stock

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Vyrian

USA . 3,300 parts In-Stock

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3,300

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Sensible Micro Corp

USA . 1,072 parts In-Stock

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1,072

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Nova Conductors

Japan . 50 parts In-Stock

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50

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Semicontronic

India . 892 parts In-Stock

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$4.000

100+ parts

$3.900

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$3.880

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-

892

$4.000

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$3.880

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Ampacity Inc.

Singapore . 701 parts In-Stock

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$4.000

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701

$4.000

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AZTECH Wire

Italy . 599 parts In-Stock

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$5.815

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Corohmni

South Africa . 1,050 parts In-Stock

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$16.531

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$16.531

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Parana Technologies

USA . 724 parts In-Stock

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$19.416

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$19.433

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724

$19.416

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ChromeModa Solutions

Germany . 2,757 parts In-Stock

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$21.816

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$17.889

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IDEA Electronic Components Group

UK . 1,462 parts In-Stock

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$21.816

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$20.725

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$19.634

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One Stop Electronics

USA . 512 parts In-Stock

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$49.000

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Continental Prestige Electronics

USA . 6,033 parts In-Stock

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Corphita

USA . 3,202 parts In-Stock

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DigiPath Technology Company

USA . 1,907 parts In-Stock

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$19.669

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Argo Parts USA

USA . 1,077 parts In-Stock

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Bastille Electronics

Australia . 800 parts In-Stock

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Overview

Enhance your electronic projects with the high-quality SN74CB3Q3251PWG4 multiplexer & demultiplexer by Texas Instruments. This versatile component, crafted from durable PLASTIC/EPOXY material, offers a powerful combination of reliability and performance. Perfect for industrial applications, this product boasts a compact design and advanced CMOS technology. With its TRUE output polarity and 3-STATE characteristics, the SN74CB3Q3251PWG4 provides seamless functionality and precise control. Elevate your projects with Texas Instruments' cutting-edge innovation and unlock endless possibilities with this top-tier component.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Lightweight and durable material for the package body, making the product easy to handle and resistant to damage.

Surface Mount: YES

Allows for easy installation on circuit boards, saving space and making it suitable for compact designs.

Nominal Supply Voltage / Vsup (V): 2.5

Operates efficiently at a low supply voltage, saving power and reducing heat dissipation.

Propagation Delay (tpd): 0.18 ns

Provides fast signal processing, making it suitable for applications requiring high speed data transfer.

Maximum Operating Temperature: 85 °C

Can operate in higher temperature environments, ensuring reliable performance in various conditions.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high noise immunity, enhancing overall performance.

Technical Specifications

Multiplexer & Demultiplexer SN74CB3Q3251PWG4 attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Texas Instruments

Specs

Family:

CB3Q/3VH/3C/2B

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

5 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inputs:

1

No. of Outputs:

8

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/3.3

Propagation Delay (tpd):

.18 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Other Logic ICs

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.3 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Trade Compliance

SN74CB3Q3251PWG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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