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SN54ALS258FH

Texas Instruments

SN54ALS258FH by Texas Instruments

SN54ALS258FH by Texas Instruments is a 4-function multiplexer with 2 inputs, operating at a supply voltage of 5V. It features a ceramic package body, operates in temperatures ranging from -55°C to 125°C, and has a terminal pitch of 1.27mm. Ideal for military-grade applications requiring TTL technology and 3-STATE output characteristics.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,725 parts In-Stock

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Digiode

USA . 4,216 parts In-Stock

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4,216

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Distributors (Availability)

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AZTECH Wire

Italy . 687 parts In-Stock

1+ parts

$17.740

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687

$17.740

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One Stop Electronics

USA . 1,306 parts In-Stock

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$18.000

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$18.000

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Parana Technologies

USA . 1,825 parts In-Stock

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$24.271

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$24.927

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1,825

$24.271

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$24.927

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DigiPath Technology Company

USA . 1,817 parts In-Stock

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$26.726

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$24.588

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1,817

$26.726

$24.588

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ChromeModa Solutions

Germany . 4,542 parts In-Stock

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$27.271

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$22.362

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4,542

$27.271

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IDEA Electronic Components Group

UK . 587 parts In-Stock

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$27.271

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$25.907

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$24.544

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587

$27.271

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$24.544

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Corphita

USA . 1,145 parts In-Stock

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Overview

Upgrade your electronics with the SN54ALS258FH by Texas Instruments, a top-quality multiplexer & demultiplexer chip designed to enhance your circuitry. Manufactured by industry leader Texas Instruments, this versatile chip offers 4 functions and 2 inputs in a compact square shape for easy integration. With a temperature range of -55C to 125C and military-grade durability, it's perfect for a wide range of applications. Experience the reliability and performance that Texas Instruments is known for, and take your projects to the next level with the SN54ALS258FH.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic material provides high durability and thermal conductivity, making the product suitable for rugged industrial environments.

Surface Mount: YES

Surface mount capability allows for easy integration onto PCBs, saving space and simplifying assembly processes.

No. of Functions: 4

Having multiple functions in a single device offers increased functionality and flexibility in system design.

No. of Inputs: 2

Having multiple inputs allows for versatile signal routing and data processing capabilities.

Package Shape: SQUARE

Square package shape enables efficient use of space on PCBs and facilitates easier layout design.

Nominal Supply Voltage / Vsup (V): 5

Having a standard supply voltage of 5V ensures compatibility with common logic levels and power sources.

No. of Terminals: 20

Having a high number of terminals enables versatile connectivity options and signal routing capabilities.

Maximum Operating Temperature: 125 °C

High maximum operating temperature ensures the device can withstand demanding operational conditions without performance degradation.

Output Characteristics: 3-STATE

3-state output allows for high impedance state, enabling efficient signal sharing and bus interfacing capabilities.

Technology: TTL

TTL technology offers fast switching speeds and low power consumption, making the product suitable for high-performance applications.

Technical Specifications

Multiplexer & Demultiplexer SN54ALS258FH attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Texas Instruments

Specs

JESD-30 Code:

S-XQCC-N20

Logic IC Type:

No. of Functions:

4

No. of Inputs:

2

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Package Body Material:

CERAMIC

Package Code:

Package Equivalence Code:

LCC20,.35SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Power Supplies (V):

5

Qualification:

Not Qualified

Sub-Category:

Multiplexer/Demultiplexers

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Trade Compliance

SN54ALS258FH Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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