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SN54150J

Texas Instruments

SN54150J by Texas Instruments

The Texas Instruments SN54150J is a 16-input multiplexer with a 20 ns propagation delay and 3-STATE output characteristics. Operating b/w -55 to 125 °C, it has a supply voltage range of 4.5V to 5.5V, making it ideal for military-grade applications requiring high-speed signal switching in compact spaces.

Median Price

$25.489

Lifecycle Status

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In-Stock Inventory

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Freelance Electronics

USA . 3 parts In-Stock

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$21.749

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Component Electronics Inc.

Canada . 1 parts In-Stock

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$21.920

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Vyrian

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Digiode

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LWI Electronics Inc

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ComSIT Distribution GmbH

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ECAB

Sweden . 33 parts In-Stock

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QIE Inc.

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Holdelec - ElecDif-Pro

France . 28 parts In-Stock

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Inland Empire Components Inc.

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Sunrise Surplus Inc.

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R&J Components

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Mil-Aero Solutions, Inc.

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Sinequanon

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First Choice Components Inc.

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Resion

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Sogenti Electronics

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Distributors (Availability)

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AZTECH Wire

Italy . 471 parts In-Stock

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Parana Technologies

USA . 1,488 parts In-Stock

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$16.732

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$16.984

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DigiPath Technology Company

USA . 486 parts In-Stock

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$18.424

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$16.950

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ChromeModa Solutions

Germany . 2,501 parts In-Stock

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IDEA Electronic Components Group

UK . 1,997 parts In-Stock

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Advanced Electronics

New Zealand . 59 parts In-Stock

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$32.134

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One Stop Electronics

USA . 925 parts In-Stock

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Component Stockers USA

USA . 636 parts In-Stock

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Corphita

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Kepictronics

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Microchip USA

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Assy Fe

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Perfect Parts

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A-Plus Industry Inc.

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Overview

Unlock the power of seamless data transmission with the SN54150J by Texas Instruments. Crafted with precision and reliability, this multiplexer and demultiplexer offers unparalleled performance in a compact package. Ideal for a wide range of applications, from telecommunications to industrial automation, this versatile component provides a seamless solution for your electronic design needs. Trust in Texas Instruments' reputation for excellence and innovation, and experience the exceptional value and benefits that the SN54150J brings to your projects. Elevate your designs with the quality and reliability you can only find from Texas Instruments.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

Provides durability and protection for the internal components, ensuring long-term reliability.

No. of Inputs: 16

Allows for versatile input options, suitable for a wide range of applications.

Nominal Supply Voltage / Vsup (V): 5

Operates at a standard voltage level, making it compatible with many systems.

Propagation Delay (tpd): 20 ns

Offers fast signal processing, ideal for time-sensitive applications.

Technology: TTL

Utilizes TTL technology known for its high-speed performance and reliability.

Technical Specifications

Multiplexer & Demultiplexer SN54150J attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Texas Instruments

Specs

Additional Features:

SN54S15J, SNJ54S15J THIS PARTS ARE REMOVED BECAUSE OF LEAF CLASS ISSUE, LG_MAX

Family:

TTL/H/L

JESD-30 Code:

R-GDIP-T24

Length:

31.75 mm

Load Capacitance (CL):

15 pF

Logic IC Type:

No. of Functions:

1

No. of Inputs:

16

No. of Outputs:

1

No. of Terminals:

24

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

INVERTED

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Equivalence Code:

DIP24,.6

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

68 mA

Propagation Delay (tpd):

20 ns

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Sub-Category:

Multiplexer/Demultiplexers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

15.24 mm

Trade Compliance

SN54150J Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-00-503-8076, 5962005038076, 5962-00-528-1771, 5962005281771, 5962-00-762-0640, 5962007620640, 5962-00-324-1456, 5962003241456, 5962-99-658-5785, 5962996585785

NIIN

005038076, 005281771, 007620640, 003241456, 996585785

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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