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SN54151W

Texas Instruments

SN54151W by Texas Instruments

The Texas Instruments SN54151W is an 8-input TTL multiplexer in a ceramic flatpack package. Operating temperature range from -55°C to 125°C makes it suitable for military-grade applications. With a nominal voltage of 5V, this surface-mount device has 16 terminals and is ideal for high-reliability electronic systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,206 parts In-Stock

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7,206

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Digiode

USA . 3,848 parts In-Stock

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3,848

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Electronic Expediters

USA . 71 parts In-Stock

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71

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,507 parts In-Stock

1+ parts

$18.713

100+ parts

-

1k+ parts

$18.806

10k+ parts

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1,507

$18.713

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$18.806

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AZTECH Wire

Italy . 675 parts In-Stock

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$19.358

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675

$19.358

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DigiPath Technology Company

USA . 2,181 parts In-Stock

1+ parts

$20.605

100+ parts

$18.957

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2,181

$20.605

$18.957

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ChromeModa Solutions

Germany . 6,169 parts In-Stock

1+ parts

$21.026

100+ parts

$17.241

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6,169

$21.026

$17.241

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IDEA Electronic Components Group

UK . 1,545 parts In-Stock

1+ parts

$21.026

100+ parts

$19.975

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$18.923

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1,545

$21.026

$19.975

$18.923

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One Stop Electronics

USA . 1,080 parts In-Stock

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$46.000

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1,080

$46.000

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Corphita

USA . 4,803 parts In-Stock

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4,803

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Overview

Unlock the power of advanced technology with the SN54151W by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments ensures top-quality products that deliver exceptional performance and reliability. The SN54151W is a versatile multiplexer & demultiplexer designed to streamline data processing and optimize efficiency. With its high-quality ceramic package body material, surface mount capability, and military-grade temperature grade, this product is built to withstand even the most demanding environments. Experience seamless operation and unmatched precision with the SN54151W, setting new standards in innovation and excellence.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic package material provides excellent durability and thermal conductivity, making this product suitable for harsh environments and high temperature applications.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, saving space and reducing manufacturing costs.

No. of Inputs: 8

With 8 inputs, this multiplexer/demultiplexer offers versatility and flexibility in signal routing and selection.

Nominal Supply Voltage / Vsup (V): 5

Operating at a nominal supply voltage of 5V makes this product compatible with standard power sources and ensures reliable performance.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature of 125°C allows for reliable operation in demanding industrial and military environments.

Technology: TTL

Utilizing TTL technology ensures fast response times and compatibility with TTL logic systems, making this product suitable for high-speed data applications.

Technical Specifications

Multiplexer & Demultiplexer SN54151W attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Texas Instruments

Specs

JESD-30 Code:

R-XDFP-F16

Logic IC Type:

No. of Functions:

1

No. of Inputs:

8

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC

Package Code:

DFP

Package Equivalence Code:

FL16,.3

Package Shape:

Package Style (Meter):

FLATPACK

Power Supplies (V):

5

Qualification:

Not Qualified

Sub-Category:

Multiplexer/Demultiplexers

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Trade Compliance

SN54151W Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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