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SN74HC257DRG4

Texas Instruments

SN74HC257DRG4 by Texas Instruments

SN74HC257DRG4 by Texas Instruments is a 4-function multiplexer with 2 inputs, operating at a supply voltage range of 2-6V. It features a propagation delay of 25ns, output polarity TRUE, and operates in industrial temperature grade applications. This CMOS technology device comes in a small outline package with surface mount capability.

Median Price

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Lifecycle Status

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6

In-Stock Inventory

1k+

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Vyrian

USA . 3,161 parts In-Stock

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Digiode

USA . 2,664 parts In-Stock

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Nova Conductors

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Connector Distribution Corp

USA . 859 parts In-Stock

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Right Parts Inc.

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Parana Technologies

USA . 1,852 parts In-Stock

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$10.441

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AZTECH Wire

Italy . 892 parts In-Stock

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One Stop Electronics

USA . 894 parts In-Stock

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ChromeModa Solutions

Germany . 4,515 parts In-Stock

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IDEA Electronic Components Group

UK . 1,655 parts In-Stock

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Ampacity Inc.

Singapore . 1,144 parts In-Stock

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Continental Prestige Electronics

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Argo Parts USA

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Corphita

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Bastille Electronics

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DigiPath Technology Company

USA . 246 parts In-Stock

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Overview

Discover the superior quality and reliability of the SN74HC257DRG4 by Texas Instruments, a leading manufacturer in the industry. As a multiplexer & demultiplexer, this product offers versatility and efficiency in various applications. With a fast propagation delay and 3-STATE output characteristics, it provides seamless operation and precise performance. Experience the value and benefits of this product with its high functionality, compact design, and wide temperature range suitability. Trust Texas Instruments for cutting-edge technology that delivers exceptional results every time.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is commonly used for electronic components due to its durability and resistance to heat and chemicals.

Propagation Delay At Nominal Supply: 25 ns

This fast propagation delay ensures efficient signal transmission and processing.

Surface Mount: YES

Surface mount technology allows for easy and compact integration of the multiplexer/demultiplexer onto circuit boards.

No. of Functions: 4

Having multiple functions in one device saves board space and simplifies circuit design.

No. of Inputs: 2

Being able to handle two inputs allows for versatile signal routing and switching capabilities.

Nominal Supply Voltage / Vsup (V): 5

Operating at a common voltage level of 5V makes integration with other components straightforward.

Load Capacitance (CL): 50 pF

This capacitance value ensures stable performance and signal integrity.

Power Supplies (V): 2/6

Support for multiple power supply voltages provides flexibility in different system configurations.

Temperature Grade: INDUSTRIAL

Suitable for use in industrial environments with temperatures ranging from -40°C to 85°C.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the device reliable and energy-efficient.

Technical Specifications

Multiplexer & Demultiplexer SN74HC257DRG4 attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Texas Instruments

Specs

Family:

HC/UH

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

9.9 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

6 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

4

No. of Inputs:

2

No. of Outputs:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Propagation Delay At Nominal Supply:

25 ns

Propagation Delay (tpd):

190 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Multiplexer/Demultiplexers

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

SN74HC257DRG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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